2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024
DOI: 10.1109/ectc51529.2024.00217
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Liquid Surface Tension-Driven Chip Self-Assembly Technology with Cu-Cu Hybrid Bonding for High-Precision and High-Throughput 3D Stacking of DRAM

Du Zehua,
Hiroshi Kikuchi,
Hayato Hishinuma
et al.
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