Lithography technology and trends for More than Moore devices: advanced packaging and MEMS devices

Pizzagalli, Amandine

doi:10.1117/12.2326784

Cited by 3 publications

(1 citation statement)

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“…Moore’s Law, known as the “gold standard” of the chip industry, appears to have reached a “bottleneck” stage as a result of the ongoing advancements in integrated circuit technology [ 1 , 2 , 3 , 4 ]. Going Beyond Moore’s Law has been suggested in this context [ 5 , 6 , 7 ], and the industry has given system-in-package (SiP) technology much attention. SiP technology combines numerous active devices that are based on bare chips with various passive devices that are all combined into a single package.…”

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confidence: 99%

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Wang

Yang

et al. 2023

Micromachines

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The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. Reliability issues must be resolved if the SiP is to operate normally. Three factors—thermal management, mechanical stress and electrical properties—can be paired with specific examples in order to detect and improve package reliability. This review provides a thorough overview of SiP technology, serves as a guide and foundation for the SiP in package reliability design, and addresses the challenges and potential for further development of this kind of package.

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