Low dielectric constant and high toughness epoxy resin based on hyperbranched polyester grafted by flexible chain modified

Wang, Zi‐long; Zhang, Xiaorui; Weng, Ling; Liu, Lizhu

doi:10.1007/s10854-019-00893-1

Cited by 34 publications

(24 citation statements)

References 39 publications

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“…As discussed in previous sections, the crosslinking density of CR‐2 resins was lower, when compared with that of cured CR‐0. Thus, the mobility of the chain segments increased, and polar groups became free to orient and relax by overcoming internal friction, the increase of free volume may reduce the dielectric properties of materials …”

Section: Resultsmentioning

confidence: 99%

Thermal and water absorption properties of cyanate ester resins modified by fluoride‐containing and silicone‐containing components

Pei

Han

Guo

et al. 2020

Polymers for Advanced Techs

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resin matrix, hence reducing the water absorption of the materials. [22][23][24][25][26][27][28][29] More importantly, silicon-containing resins exhibited excellent heat resistance, weather resistance, and electrical insulation, 1,8,[30][31][32][33][34][35][36] while fluorine-containing resins also have advantages in heat resistance, dielectric properties, chemical stability, weather resistance, and nonflammability. These features were made silicon-containing and fluorine-containing resins suitable components for the modification of high temperature dielectric thermosets, and some successful examples were already realized in CE resins. Yang et al reported the preparation of epoxidized polysiloxane (E-Si), and the addition of E-Si into CE resin cannot only significantly decrease the curing temperature of the CE resin but also improve its water resistance and toughness. 22 Dai et al reported an epoxidized polysiloxane with amino silicone and used it as a modifier to effectively reduce the dielectric constant of CE resin. 28 Guenthner et al reported the preparation of a novel silyl cyanate monomer from bis (4-cyanophenyl) dimethylsilane (Simcy), and moisture absorption of the as-prepared CE resin was reduced by 50%, when compared with pure CE resin. 37 Gu's group synthesized high-quality and stable fluoride-containing compound 2-((3-(trifluoromethyl)phenoxy)methyl) oxirane (TFMPMO), and the results showed that TFMPMO was gifted with lower moisture absorption than cyanate ester resins. 25 Chao Yuan et al prepared a novel fluoropolymer, which could help reduce the moisture absorption of pure CE resin. 8 Guo et al 26 prepared a novel fluorinated allyl compound (6FDABPA) and used it to reduce water absorption of CE resins. As mentioned above, fluorine-and silicon-containing resins have demonstrated positive effect on the hygroscopicity of CE resins. However, comprehensive evaluation should be considered during the modification of CE resins, where the suppression of water absorption should not berealized at big costs of thermal and mechanical properties. 8,32,33 Herein in this paper, a series of novel silicone-containing and fluorine-containing components were prepared and introduced into CE resins, and the water absorption, thermal, mechanical, and dielectric properties were systematically characterized. The structure-property relationship was proposed and discussed.

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Section: Resultsmentioning

confidence: 99%

Thermal and water absorption properties of cyanate ester resins modified by fluoride‐containing and silicone‐containing components

Pei

Han

Guo

et al. 2020

Polymers for Advanced Techs

View full text Add to dashboard Cite

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“…and dielectric properties without losing its heat resistance (i.e., Tg). Wang et al [10] reported the synthesis of a toughening agent based on a hyper-branched polyester having flexible chain blocking. By incorporating 20 wt % of toughener in epoxy phase, an increase of 122% and 184% was observed in bending strength and impact strength, respectively.…”

Section: Effect Of Toughener Contentmentioning

confidence: 99%

“…The fibre-reinforced composite materials usually suffer from poor resistance to inter-laminar fracture induced by impact damage due to the lower toughness and crack resistance of epoxy matrix. Therefore, the fracture toughness of the matrix affects the damage tolerance of the composites, which is relevant in aerospace applications, and, consequently, the toughening of epoxy resin has received significant attention [ 9 , 10 , 11 , 12 , 13 ].…”

Section: Introductionmentioning

confidence: 99%

Toughening of Epoxy Systems with Interpenetrating Polymer Network (IPN): A Review

2020

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Epoxy resins are widely used for different commercial applications, particularly in the aerospace industry as matrix carbon fibre reinforced polymers composite. This is due to their excellent properties, i.e., ease of processing, low cost, superior mechanical, thermal and electrical properties. However, a pure epoxy system possesses some inherent shortcomings, such as brittleness and low elongation after cure, limiting performance of the composite. Several approaches to toughen epoxy systems have been explored, of which formation of the interpenetrating polymer network (IPN) has gained increasing attention. This methodology usually results in better mechanical properties (e.g., fracture toughness) of the modified epoxy system. Ideally, IPNs result in a synergistic combination of desirable properties of two different polymers, i.e., improved toughness comes from the toughener while thermosets are responsible for high service temperature. Three main parameters influence the mechanical response of IPN toughened systems: (i) the chemical structure of the constituents, (ii) the toughener content and finally and (iii) the type and scale of the resulting morphology. Various synthesis routes exist for the creation of IPN giving different means of control of the IPN structure and also offering different processing routes for making composites. The aim of this review is to provide an overview of the current state-of-the-art on toughening of epoxy matrix system through formation of IPN structure, either by using thermoplastics or thermosets. Moreover, the potential of IPN based epoxy systems is explored for the formation of composites particularly for aerospace applications.

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“…Various methods to reduce the dielectric constant have been studied, such as the fluorinated modification of chain backbone, [ 11,12 ] the introduction of fluorine‐containing nanoparticles [ 13–15 ] or hollow nanoparticles, [ 16 ] and the synthesis of hyperbranched polyester grafted by flexible chain to increase the free volume. [ 17 ]…”

Section: Introductionmentioning

confidence: 99%

Effect of polyhedral oligomeric silsesquioxanes with different structures on dielectric and mechanical properties of epoxy resin

et al. 2021

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Polyhedral oligomeric silsesquioxane (POSS) is a hybrid material composed of an organic substituent shell and inorganic skeleton core. To study the influence of different shells and cage‐shaped cores on dielectric and mechanical properties, four kinds of epoxy resin composites (EPs) fabricated with 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO), DOPO‐containing polyhedral oligomeric silsesquioxane (DOPOPOSS), octaphenyl polyhedral oligomeric silsesquioxane (OPS), and epoxy phenyl polyhedral oligomeric silsesquioxane (EPOSS) with the addition of 5 and 10 wt% were prepared, respectively. The dispersion, transparency, glass transition, dielectric, mechanical tensile, flexural, and impact properties of these epoxy resins were studied. Dielectric constant and loss of EPs were significantly reduced through introduction of three POSSs owing to their inherent hollow cores, and dielectric constant of the resins was further decreased with additional increase. Compared with three POSSs, DOPOPOSS had the best compatible shell, and its composites exhibited favorable transparency similar to pure EP and the obvious reduction in dielectric constant and loss, due to its nano‐dispersion in matrix. EPOSS was dispersed in a perfect spherical shape and uniformly embedded in matrix, and the composites showed good mechanical tensile, flexural, and impact strength. OPS was disorderly dispersed in resins, but its eight phenyl rings symmetrical shell had the advantage of nonpolar molecule structure, which endowed epoxy resin lower dielectric loss over the high‐frequency range (105–106 Hz). Compared with DOPOPOSS, DOPO was effective in reducing dielectric constant and loss of epoxy resin due to its reactive addition, however, it decreased the glass transition temperature, mechanical tensile, flexural, and impact strength of epoxy resin either.

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Low dielectric constant and high toughness epoxy resin based on hyperbranched polyester grafted by flexible chain modified

Cited by 34 publications

References 39 publications

Thermal and water absorption properties of cyanate ester resins modified by fluoride‐containing and silicone‐containing components

Thermal and water absorption properties of cyanate ester resins modified by fluoride‐containing and silicone‐containing components

Toughening of Epoxy Systems with Interpenetrating Polymer Network (IPN): A Review

Effect of polyhedral oligomeric silsesquioxanes with different structures on dielectric and mechanical properties of epoxy resin

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