Abstract:We have developed the new "Yin-Yang" feedback technology for SRAM cells. This technology is applied to sixtransistor cells and four-transistor cells, which are composed of transistors with the new DZG-SO1 structure. At the 65-nm process node, these cells can operate at 0.7 V in massproduced LSIs under real usage conditions. Max. operating speeds are 300 MHz for the six-transistor and 200 MHz for the four-transistor cell. Leakage cnrrent of the four-transistor cell is about 1/1000 that of a conventional four-tr… Show more
“…The strong BG biasing effect can thus be leveraged [39] to optimize the performance of FinFET-based SRAMs through a dynamic adjustment of the effective cell -ratio.…”
Section: B Finfet Sram Cell Designs 1) Conventional Double-gated (Dgmentioning
confidence: 99%
“…Without major impact on RSNM, the pMOS load devices can be made weaker by adjusting their gate lengths. However, this technique will only yield a marginal improvement in the write margin; a much more significant improvement can be attained by lowering the supply voltage during write, while maintaining the WL voltage [39]. This is made possible by adopting a long-aspect-ratio cell layout, which is typical in today's designs for better manufacturability [2], [40]- [42], since the cell supply can be routed vertically for each column and can be exploited to break the contention between read and write optimization.…”
Section: B Finfet Sram Cell Designs 1) Conventional Double-gated (Dgmentioning
Abstract-Process-induced variations and sub-threshold leakage in bulk-Si technology limit the scaling of SRAM into sub-32 nm nodes. New device architectures are being considered to improve control and reduce short channel effects. Among the likely candidates, FinFETs are the most attractive option because of their good scalability and possibilities for further SRAM performance and yield enhancement through independent gating. The enhancements to read/write margins and yield are investigated in detail for two cell designs employing independently gated FinFETs. It is shown that FinFET-based 6-T SRAM cells designed with pass-gate feedback (PGFB) achieve significant improvements in the cell read stability without area penalty. The write-ability of the cell can be improved through the use of pull-up write gating (PUWG) with a separate write word line (WWL). The benefits of these two approaches are complementary and additive, allowing for simultaneous read and write yield enhancements when the PGFB and PUWG designs are used in combination.
“…The strong BG biasing effect can thus be leveraged [39] to optimize the performance of FinFET-based SRAMs through a dynamic adjustment of the effective cell -ratio.…”
Section: B Finfet Sram Cell Designs 1) Conventional Double-gated (Dgmentioning
confidence: 99%
“…Without major impact on RSNM, the pMOS load devices can be made weaker by adjusting their gate lengths. However, this technique will only yield a marginal improvement in the write margin; a much more significant improvement can be attained by lowering the supply voltage during write, while maintaining the WL voltage [39]. This is made possible by adopting a long-aspect-ratio cell layout, which is typical in today's designs for better manufacturability [2], [40]- [42], since the cell supply can be routed vertically for each column and can be exploited to break the contention between read and write optimization.…”
Section: B Finfet Sram Cell Designs 1) Conventional Double-gated (Dgmentioning
Abstract-Process-induced variations and sub-threshold leakage in bulk-Si technology limit the scaling of SRAM into sub-32 nm nodes. New device architectures are being considered to improve control and reduce short channel effects. Among the likely candidates, FinFETs are the most attractive option because of their good scalability and possibilities for further SRAM performance and yield enhancement through independent gating. The enhancements to read/write margins and yield are investigated in detail for two cell designs employing independently gated FinFETs. It is shown that FinFET-based 6-T SRAM cells designed with pass-gate feedback (PGFB) achieve significant improvements in the cell read stability without area penalty. The write-ability of the cell can be improved through the use of pull-up write gating (PUWG) with a separate write word line (WWL). The benefits of these two approaches are complementary and additive, allowing for simultaneous read and write yield enhancements when the PGFB and PUWG designs are used in combination.
“…That is why the inductive-coupling link does not affect SRAM operation in typical region of supply voltage while soft errors may affect. Compared with influence from device variations, it is much smaller since the difference in supply voltage of 10 mV corresponds to the difference in threshold voltage variation of 1 mV (Yamaoka et al, 2004), which is much smaller than process variation. From this measurement result, we have reached to a conclusion that inductive-coupling link can be placed near the SRAM circuits.…”
Section: Interference From An Inductive-coupling Link To Sram Array Omentioning
“…The maximum critical path delay distribution, including both WID and D2D variations, is analyzed for three technologies: one 65-nm commercial technology and two future technology nodes 45 and 32 nm. Both the 45-and 32-nm technologies are hypothetical, and the parameters have been selected to anticipate a realistic set [10,18,[33][34][35][36].…”
Section: Maximum Critical Path Delay Distribution With Combined Die-tmentioning
confidence: 99%
“…= / for WID, D2D variations, and for critical path length n cp are given in Table 3.4. Standard deviation values are estimated by combining V th and L according to [18,[33][34][35][36], and n cp is estimated as presented in [32]. N cp D 10 4 ; finally, R D 5 in all calculations.…”
Section: Maximum Critical Path Delay Distribution With Combined Die-tmentioning
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