Low-Temperature Curing Polyimide Composites with Low Coefficient of Thermal Expansion for High-Temperature Electronic Packaging

Hou, tianqi; He, Chuan; Lin, Ying; Zhao, Yushun; Ding, Lijian

doi:10.2139/ssrn.5049615

2024

DOI: 10.2139/ssrn.5049615

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Low-Temperature Curing Polyimide Composites with Low Coefficient of Thermal Expansion for High-Temperature Electronic Packaging

tianqi Hou,

Chuan He,

Ying Lin

et al.

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Low-Temperature Curing Polyimide Composites with Low Coefficient of Thermal Expansion for High-Temperature Electronic Packaging

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References 28 publications

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