Low Temperature Direct Bonding 3D Stacking Technologies for High Density Device Integration

Di Cioccio, Lea; Radu, Ionut; Gaudin, Gweltaz; Lacave, Thomas; Baudin, Floriane; Sadaka, Mariam; Signamarcheix, Thomas

doi:10.1149/ma2013-02/33/2215

Meet. Abstr.

2013

DOI: 10.1149/ma2013-02/33/2215

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Low Temperature Direct Bonding 3D Stacking Technologies for High Density Device Integration

Lea Di Cioccio,

Ionut Radu,

Gweltaz Gaudin

et al.

Abstract: not Available.

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Low Temperature Direct Bonding 3D Stacking Technologies for High Density Device Integration

Abstract: not Available.

Cited by 0 publications

References 3 publications

No citations

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