<title>Ion projection lithography: progress in mask and tool technology</title>

Abstract

Ion Projection Lithography is one of the major competitors for sub lOOnm-lithography. Within the MEDEA ion projection lithography project and other activities related to it, new results in mask and tool technology have been obtained.The exposure tool is in process of being assembled, so that information of the components as the multi-cusp ion source can be given. Results from the field-composable lens electrode manufacturing and of the off-axis alignment system are to he presented.Mask process technology has been improved by introduction of a multi-step trench etch technique. A stencil mask based on a 200mm wafer has been produced. In addition, the repeatability values of placement and CD measurements have been decreased. Defect inspection with optical KLA tool results give information on the current limits for stencil mask applications.