LTCC: a fascinating technology platform for miniaturized devices

Abstract

Recently, miniaturized devices and microstructures made from Low Temperature Cofired Ceramics (LTCC) are gaining increasing interest due to advantages especially on the field of a simplified wiring approach. This is in particular true when applications are targeted for theses devices where harsh environmental conditions are present, such as high temperatures, aggressive media or high system-related pressure levels. In this paper an overview is given on some selected devices for automotive and airborne applications designed for such challenging system constraints. For an enhanced performance of these miniaturized sensor elements, basic investigations are performed on the novel use of thin film metallization on LTCC substrates which are basically designed for thick film technology.