Making metal surfaces strong, resistant, and multifunctional by nanoscale-sculpturing

Baytekin-Gerngross, Melike; Gerngroß, Mark‐Daniel; Carstensen, Jürgen; Adelung, Rainer

doi:10.1039/c6nh00140h

Cited by 22 publications

(11 citation statements)

References 33 publications

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“…The precise interplay between etching and passivation conditions and their match up following the concept of nanoscale sculpturing 31 are the decisive point in the crystallographic pore growth in Zn. The passivation has to be adjusted in such a way that it is strong enough on the pore walls, so that the pore walls are maintained during the anodic pore growth phase, but not too strong, so that pore growth can progress at the pore tip and is not prevented by the passivation.…”

Section: Journal Of Thementioning

confidence: 99%

“…In terms of the resulting Zn surface morphologies all studies performed so far exhibited no formation of pores in Zn till very recently pore growth in Zn was reported by electrochemical nanoscale sculpturing. 31 The decisive idea of the nanoscale sculpturing concept is to specifically adjust the intermediate formation of an oxide layer on the metal surface and z E-mail: mdg@tf.uni-kiel.de its subsequent controlled dissolution. The present work further extends this research showing structural and chemical properties of the electrochemically nanoscale sculptured Zn pore structures, exploiting their characteristic features as well as providing insights into the pore growth conditions.…”

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confidence: 99%

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Self-Organized Growth of Crystallographic Macropores in Multicrystalline Zn by Nanoscale Sculpturing

Gerngroß

Baytekin-Gerngross

Carstensen

et al. 2018

J. Electrochem. Soc.

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The self-organized formation of crystallographically oriented macropores in multicrystalline Zn is presented in the present paper. These pores are obtained by pulsed-potential electrochemical etching in an aqueous KCl electrolyte. They exhibit the typical characteristics of crystallographically-oriented pores like growth along certain crystallographic directions, formation of pore domains, branching of pores, and intersections of pores, as observed for e.g. III-V semiconductors such as InP. The pore walls of the pores in Zn are entirely composed of metallic Zn unlike the amorphous metal oxide ones observed in other metals like Al (AAO) or Ti (TiO 2 ). The main pore growth direction in Zn is along <0001>. The branching of side pores occurs along [1210] and [1210] in 90 • angles from the root pore forming a pore geometry reminding remotely on a monkey puzzle tree. Because of their crystallographic nature of the pores they grow under various angles into the multicrystalline Zn surface depending on the underlying crystal orientation. Like this they form a perfectly suitable structure for mechanical interlocking with polymers. When filled with polymer, the root pores together with the branched side pores act as ideal hooks anchoring the polymer in Zn solving the well-known problem of poor adhesion of polymers and paint on Zn surfaces.

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Section: Journal Of Thementioning

confidence: 99%

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confidence: 99%

Self-Organized Growth of Crystallographic Macropores in Multicrystalline Zn by Nanoscale Sculpturing

Gerngroß

Baytekin-Gerngross

Carstensen

et al. 2018

J. Electrochem. Soc.

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“…In this study, an ultrascalable, superhydrophilic, costeffective, simple, and highly durable surface structuring technique for Al substrates using crystallographic hydrochloric acid (HCl) etching is demonstrated. 38,39 The crystallographic etching technique to develop structures has three main advantages. First, the structure length scale for etched Al is larger than the majority of considered structures in the past, enabling greater structure strength and resilience to external forces such as shear and abrasion when compared to fragile nanostructures.…”

Section: ■ Introductionmentioning

confidence: 99%

Scalable and Resilient Etched Metallic Micro- and Nanostructured Surfaces for Enhanced Flow Boiling

Upot

Mahvi

Rabbi

et al. 2021

ACS Appl. Nano Mater.

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Flow boiling and evaporation in tubes and channels occur in a wide variety of energy systems, such as refrigeration, air conditioning, power generation, electronics cooling, distillation, and purification. In this work, we demonstrate remarkably increased heat transfer coefficients of 270% during refrigerant flow boiling in scalable microstructured (∼40 μm), industrial-scale (∼1 m long) aluminum (Al) tubes, when compared to smooth unstructured Al tubes. To achieve scalable nanomanufacturing, we create highly conformal and durable structured surfaces by relying on hydrochloric acid Al etching. Flow boiling tests were conducted in 6.35 mm diameter Al tubes using R134a refrigerant as the working fluid. To benchmark our approach and to elucidate the effect of the structure length scale, we also fabricated ultrascalable boehmite (AlO(OH)) nanostructured (∼300 nm) Al tubes, showing that etched microscale features are necessary and key to enhancement. Durability tests conducted using a 28 day long continual flow boiling experiment demonstrated negligible degradation of the etched surfaces. The scalable and cost-effective techniques used to create these durable, etched-Al microstructures may significantly reduce manufacturing cost when contrasted with current enhancement approaches such as extrusion, drawing, and welding.

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“…To achieve the necessary industry-standard reliability, the bond-line thickness (BLT) for the EI based on typical DAA or solder is often required to be as thick as over 25 or 30 μm, respectively, while for the EI using DAF, the BLT is still as thick as 10 μm. Recent innovative efforts on off-chip EIs include the method of MesoGlue [ 9 ], nanoscale-surface-sculpturing [ 10 ], nanosized Ag powder sintering [ 11 ], nanoporous (NP) metals [ 12 ], and nano- and micro-metal pastes [ 13 ], however, unfortunately, none of them is demonstrated to be able to reduce the BLT to below one micrometer. The size reduction in off-chip EIs often suffers from insurmountable electrical and reliability issues [ 14 ].…”

Section: Introductionmentioning

confidence: 99%

Semiconductor Chip Electrical Interconnection and Bonding by Nano-Locking with Ultra-Fine Bond-Line Thickness

et al. 2021

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The potential of an innovation for establishing a simultaneous mechanical, thermal, and electrical connection between two metallic surfaces without requiring a prior time-consuming and expensive surface nanoscopic planarization and without requiring any intermediate conductive material has been explored. The method takes advantage of the intrinsic nanoscopic surface roughness on the interconnecting surfaces: the two surfaces are locked together for electrical interconnection and bonding with a conventional die bonder, and the connection is stabilized by a dielectric adhesive filled into nanoscale valleys on the interconnecting surfaces. This “nano-locking” (NL) method for chip interconnection and bonding is demonstrated by its application for the attachment of high-power GaN-based semiconductor dies to its device substrate. The bond-line thickness of the present NL method achieved is under 100 nm and several hundred times thinner than those achieved using mainstream bonding methods, resulting in a lower overall device thermal resistance and reduced electrical resistance, and thus an improved overall device performance and reliability. Different bond-line thickness strongly influences the overall contact area between the bonding surfaces, and in turn results in different contact resistance of the packaged devices enabled by the NL method and therefore changes the device performance and reliability. The present work opens a new direction for scalable, reliable, and simple nanoscale off-chip electrical interconnection and bonding for nano- and micro-electrical devices. Besides, the present method applies to the bonding of any surfaces with intrinsic or engineered surface nanoscopic structures as well.

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Making metal surfaces strong, resistant, and multifunctional by nanoscale-sculpturing

Abstract: Surfaces are the crucial and limiting factor in nearly all metal applications, especially when technologically relevant alloys are employed.

Cited by 22 publications

References 33 publications

Self-Organized Growth of Crystallographic Macropores in Multicrystalline Zn by Nanoscale Sculpturing

Self-Organized Growth of Crystallographic Macropores in Multicrystalline Zn by Nanoscale Sculpturing

Scalable and Resilient Etched Metallic Micro- and Nanostructured Surfaces for Enhanced Flow Boiling

Semiconductor Chip Electrical Interconnection and Bonding by Nano-Locking with Ultra-Fine Bond-Line Thickness

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