Abstract:The interaction between cores and memory blocks, in multiprocessor chips and smart systems, has always been a concern as it affects network latency, memory capacity, and power consumption. A new 2.5-dimensional architecture has been introduced in which the communication between the processing elements and the memory blocks is provided through a layer called the interposer. If the core wants to connect to another, it uses the top layer, and if it wants to interact with the memory blocks, it uses the interposer … Show more
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