Manufacturing of a 70 × 70 mm2 LTCC strip electrode readout for Gas Electron Multiplier detectors

Babij, Michał; Bielówka, Piotr; Dąbrowski, Arkadiusz; Nawrot, Witold; Czok, Mateusz; Malecha, Karol

doi:10.1016/j.sna.2022.113656

Cited by 3 publications

(3 citation statements)

References 13 publications

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“…The parallel groove patterns can be used as a stamp or mold for nano-imprinting different waveguide devices, which normally have equal or various grating elements [4]. The 2D micro-structures with regular distribution and geometric topology are machined on the specimen surface, which can endow devices with specific functions, such as information storage, optical reflection and lubrication [37,38].…”

Section: Experiments and Discussionmentioning

confidence: 99%

Implementation of cross-scale plane micro-scratching process driven by hybrid piezoelectric actuation

Sun

Deng

et al. 2023

Smart Mater. Struct.

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The atomic force microscope (AFM) tip-based mechanical machining technique has been used to fabricate complex micro-structures successfully. However, the machining scope and depth are limited, which holds back this technique severely. This work presents the design and evaluation of a piezoelectric manufacturing system (PMS) for implementation of cross-scale (large scale and high resolution) plane micro-scratching. The PMS has the two-dimensional (2D) micro-machining ability with depths up to 0.98 μm in the millimeter machining scope through the combination of a travel range XY positioning stage and a three-degree-of-freedom (3-DOF) sandwich piezoelectric manipulator. The tracing property of the PMS is feasible for large scale machining by controlling the multi-axis cooperative motion of the 2-DOF stage. The experiments show that the micro-triangles and micro-circles arrays with dimensions from 40 μm to 400 μm are machined successfully. The deviations of the position determination and machined depths for all the micro-structures are less than 5%. Further, it is verified that the manipulator has potential to be used in vibration-assisted cutting to improve machining quality. To sum up, the PMS shows great prospects in the applications of machining cross-scale and large depth planar micro-structures.

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Section: Experiments and Discussionmentioning

confidence: 99%

Implementation of cross-scale plane micro-scratching process driven by hybrid piezoelectric actuation

Sun

Deng

et al. 2023

Smart Mater. Struct.

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“…Several metal and ceramic parts were placed on the detector window during tests. The parts are shown in Figure 7d [18]. The detector with samples was irradiated for about 3 h for each test to obtain enough data.…”

Section: Performance Measurements Of a Gem Detector With Pcb Readout ...mentioning

confidence: 99%

“…The charge-sharing compensation in the readout designs is described in Section 2 of this paper. The measurements are based on comparing the charge distribution histograms calculated separately for each axis-this method is described in more detail in [18,19]. The charge histograms were made separately for each axis from 512,000 subsequent samples.…”

Section: Performance Measurements Of a Gem Detector With Pcb Readout ...mentioning

confidence: 99%

A Segmental 2D Readout Board Manufactured in Printed Circuit Board Technology for Gas Electron Multiplier Detectors

Babij,

Bielówka,

Gburek

et al. 2023

Sensors

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The Gas Electron Multiplier (GEM) was introduced by Fabio Sauli in 1997. This technology is broadly used in current and planned High-Energy Physics (HEP) experiments. One of the key components of these detectors is a readout board, which collects charges amplified by GEM foils and transfers them to readout electronics. The commonly used Cartesian XY readout boards are manufactured from the same type of polyamide film used to produce the GEM foils. The manufacturing process utilizes a deep polyimide etching, similar to the Micro Chemical Vias (MCV) etching process, which is protected by patent. The material prepared in this way is glued onto a rigid substrate and mounted in a detector. The production process was developed at CERN, and the technology has been commercialized to a small extent. Consequently, only a few research centers have the ability to make dedicated readout strips readouts. GEM detectors are characterized by a segmented structure that allows the separation of an electron-multiplying structure from a readout. This feature enables the implementation of a new type of charge reading system without the need to interfere with the GEM foil system. A new approach is proposed to simplify production and reduce the costs of GEM detector readout boards. It is based on the concept of segmental readout structures that are manufactured in standard Printed Circuit Board (PCB) technology. The interconnectors and mountings are located on the back of the bottom, so it is possible to place the readout electronics behind the readout plate. The boards are designed in such a way that they can be panelized into a readout with a more extensive active area. The margin between PCBs is minimalized to approximately 200 µm, which is less than 1% of the 70 × 70 mm2 board area, so the active area is as big as possible. Therefore, this solution gives us the ability to further increase the size of a readout by adding additional segments, which reduces the cost of scaling up the detector size. A few research groups have suggested similar solutions that utilize PCB technology, but currently, only detectors with 1D zigzag readouts have been validated and used. The measurement results of other 2D (XY) redouts using PCB technology have not been presented. The measurements shown and discussed in this paper validated the proposed technology. X-ray radiographs were obtained, validating the ability to use this technology to manufacture readout boards for GEM detectors. In opposition to state-of-the-art readouts, the proposed solution can be manufactured by any PCB manufacturer without using MCV-patented technology. This gives the users flexibility in designing and ordering low-cost custom readouts.

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Stability of Dielectric Properties of LTCC After Ionizing Irradiation

Dąbrowski

Głowinkowski

Wilk

et al. 2023

IEEE Trans. Dielect. Electr. Insul.

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Manufacturing of a 70 × 70 mm2 LTCC strip electrode readout for Gas Electron Multiplier detectors

Cited by 3 publications

References 13 publications

Implementation of cross-scale plane micro-scratching process driven by hybrid piezoelectric actuation

Implementation of cross-scale plane micro-scratching process driven by hybrid piezoelectric actuation

A Segmental 2D Readout Board Manufactured in Printed Circuit Board Technology for Gas Electron Multiplier Detectors

Stability of Dielectric Properties of LTCC After Ionizing Irradiation

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