Material removal characterization during axial ultrasonic vibration grinding SiCp/Al composites with a single diamond grain

Peng, Jianhao; Yao, Yu; Xu, Zhipeng; Yao, Xuebin; Zhao, Biao; Ding, Wenfeng

doi:10.1007/s00170-024-14457-z

Int J Adv Manuf Technol

2024

DOI: 10.1007/s00170-024-14457-z

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Material removal characterization during axial ultrasonic vibration grinding SiCp/Al composites with a single diamond grain

Jianhao Peng,

Yu Yao,

Zhipeng Xu

et al.

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Material removal characterization during axial ultrasonic vibration grinding SiCp/Al composites with a single diamond grain

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References 36 publications

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