Materials and processes for electronic devices and components: how they contribute to corrosion reliability?

Exploring the comminution process of waste printed circuit boards in recycling: a review

“…In general, a particular type of resin polymer consists of embedded glass fibers. FR-4 is one of the laminate materials that is most frequently used in electronics [32,33]. Figure 1 depicts the cross section of a typical FR-4 laminate substrate for PCB production.…”

“…Fig. 1 An optical view displaying the bundles of fibers buried in the epoxy matrix and a magnified SEM image of a typical fiber-reinforced FR-4 laminate [32] Fig. 2 Grain structure of two copper types (a) Electrodeposited copper and (b) Rolledannealed copper [36] Broadly speaking, materials that are secured through fastening methods like screws, clinks, and rivets, as well as inserting, wrapping, and packaging, can be easily detached.…”

“…The number of layers ranges from 3 to as many as 50 in special applications [9]. Flexibility also varies-flexible PCBs use thin, bendable laminates suitable where folding is needed, while rigid PCBs use rigid laminates and can be single-sided, double-sided or multilayered [32].…”

“…Fig. 4 Schematics of single, double, and multilayered printed circuit boards along with a cross-sectional image of the real double-sided and multilayered PCBs [32] Fig. 5 Fracture toughness vs. yield strength for different materials [60] These two studies presented contradictory conclusions regarding the effects of copper layers on WPCB mechanical strength.…”