“…Although the wet method exhibits a higher throughput, dry method exhibits a better profile performance and is widely applied in the semiconductor industry. Sulfur hexafluoride (SF 6 ) is typically used as an etchant in dry silicon etching [ 14 , 15 ], and maskless plasma etching technology can reduce the cost of silicon microstructure fabrication because photolithography is expensive and complicated [ [16] , [17] , [18] ].…”