Measuring Temperature Swing with Optical Fibers during Power Cycling of Power Components

Zhang, Kaichen; Iannuzzo, Francesco

doi:10.1109/pedg54999.2022.9923077

Cited by 7 publications

(3 citation statements)

References 13 publications

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“…However, none of these include the loss mechanism dependencies of the parasitic capacitive couplings. To quantify the impact of the capacitive couplings on the power semiconductor reliability, the power dissipation and thermal stresses of the components are often considered as informative quantities as the mean temperature and temperature swing of a device are directly correlated to the power dissipation of the device [84], [85], as depicted by ( 2) and (5).…”

Section: Reliability and Thermal Stressesmentioning

confidence: 99%

Parasitic Capacitive Couplings in Medium Voltage Power Electronic Systems: An Overview

Kjærsgaard

Liu

Nielsen

et al. 2023

IEEE Trans. Power Electron.

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Section: Reliability and Thermal Stressesmentioning

confidence: 99%

Parasitic Capacitive Couplings in Medium Voltage Power Electronic Systems: An Overview

Kjærsgaard

Liu

Nielsen

et al. 2023

IEEE Trans. Power Electron.

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“…Recently, optical-based sensing (OBS) techniques have taken center stage as a viable non-invasive electromagnetic interference (EMI) immune junction temperature sensing technology, as highlighted in Table 1 , and have been implemented for thermal monitoring in power grid systems and industrial plants operation [ 16 ]. OBS techniques include IRC, TSOP, and FBG approaches for junction temperature measurements.…”

Section: Introductionmentioning

confidence: 99%

Junction Temperature Optical Sensing Techniques for Power Switching Semiconductors: A Review

Isa,

Mirza,

Ghafoor

et al. 2023

Micromachines

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Recent advancements in power electronic switches provide effective control and operational stability of power grid systems. Junction temperature is a crucial parameter of power-switching semiconductor devices, which needs monitoring to facilitate reliable operation and thermal control of power electronics circuits and ensure reliable performance. Over the years, various junction temperature measurement techniques have been developed, engaging both non-optical and optical-based methods, highlighting their advancements and challenges. This review focuses on several optical sensing-based junction temperature measuring techniques used for power-switching devices such as metal-oxide-semiconductor field-effect transistors (MOSFETs) and insulated-gate bipolar transistors (IGBTs). A comprehensive summary of recent developments in infrared camera (IRC), thermal sensitive optical parameter (TSOP), and fiber Bragg grating (FBG) temperature sensing techniques is provided, shedding light on their merits and challenges while providing a few possible future solutions. In addition, calibration methods and remedies for obtaining accurate measurements are discussed, thus providing better insight and directions for future research.

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“…A technology of fibre optic sensor-based temperature measurement is demonstrated for power modules in [40]. However, the studied converter used AC and DC power cyclic testing on the specific device and only estimated the junction temperature swing.…”

Section: Introductionmentioning

confidence: 99%

Thermal Analysis of Si-Igbt Based Power Electronic Modules in 50kw Traction Inverter Application

Shahjalal¹,

Shams²,

Hossain

et al. 2022

SSRN Journal

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Measuring Temperature Swing with Optical Fibers during Power Cycling of Power Components

Cited by 7 publications

References 13 publications

Parasitic Capacitive Couplings in Medium Voltage Power Electronic Systems: An Overview

Parasitic Capacitive Couplings in Medium Voltage Power Electronic Systems: An Overview

Junction Temperature Optical Sensing Techniques for Power Switching Semiconductors: A Review

Thermal Analysis of Si-Igbt Based Power Electronic Modules in 50kw Traction Inverter Application

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