Mechanical characterization of nanostructured thin films at different scales

Abstract

Abstract. The mechanical behaviour of multilayered W/Cu thin films on polyimide substrate has been investigated at different scales and using complementary X-ray techniques and compared to finite element analysis. Mechanical testing has been carried out using a new biaxial tensile machine which allows for testing in controlled biaxial loading condition. This device has been developed for synchrotron measurements at DiffAbs beamline of the French synchrotron radiation facility (SOLEIL, Saint Aubin).