2016
DOI: 10.1038/srep21864
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Mechanical Fracturing of Core-Shell Undercooled Metal Particles for Heat-Free Soldering

Abstract: Phase-change materials, such as meta-stable undercooled (supercooled) liquids, have been widely recognized as a suitable route for complex fabrication and engineering. Despite comprehensive studies on the undercooling phenomenon, little progress has been made in the use of undercooled metals, primarily due to low yields and poor stability. This paper reports the use of an extension of droplet emulsion technique (SLICE) to produce undercooled core-shell particles of structure; metal/oxide shell-acetate (‘/’ = p… Show more

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Cited by 84 publications
(75 citation statements)
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“…The spherical liquid particles deform into uniform films that are solid, continuous, and conductive (resistivity = 15 µΩ‐cm). As expected, all solidification occurs with concomitant spinodal decomposition (Figure c,h,m) 9b…”
Section: Resultssupporting
confidence: 82%
See 3 more Smart Citations
“…The spherical liquid particles deform into uniform films that are solid, continuous, and conductive (resistivity = 15 µΩ‐cm). As expected, all solidification occurs with concomitant spinodal decomposition (Figure c,h,m) 9b…”
Section: Resultssupporting
confidence: 82%
“…Undercooled metal particles were prepared using the SLICE method 9b. Field‘s metal—a low‐melting, fusible eutectic alloy of bismuth, indium, and tin (Bi: 32.5/In: 51/Sn: 16.5 wt%, T m = 62 °C)—was significantly undercooled (degree of undercooling, Δ T/T m = 0.34) at high yields (>97%, see Figure S1, Supporting Information).…”
Section: Resultsmentioning
confidence: 99%
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“…It is useful to find a basic phenomenon to leverage, starting from those that are either highly reversible or highly irreversible (it narrows the search and facilitates achieving reliability and predictability in the final solution), and that are out of left field (if the problem is longstanding, out of left field solutions are more likely to work). In a recent example, the metastable nature of undercooled metal particles was exploited to prepare heat‐free ‘solder’ which circumbents many drawbacks of conventional joining techniques and is especially valuable for flexible electronic device fabrication …”
Section: How To Pursue Simplicity In Materials Research?mentioning
confidence: 99%