Mechanically robust epoxy with electrical breakdown healing capability for power equipment insulation via dynamic networks

Self-healing of electrical damage in insulating robust epoxy containing dynamic fluorine-substituted carbamate bonds for green dielectrics

“…The absence of characteristic peaks at 2250 cm −1 verifies the full consumption of the isocyanate group in the process of curing. 28 The isocyanates react with hydroxyl groups to form the carbamate structure, which is confirmed by the peak of 1715 cm −1 . Its crosslinked feature can be proved by swelling experiments (Fig.…”

“…27 In fact, electrical damage is more difficult to be healed not only due to the complex branched feature but also due to the variation in chemical components caused by electrical degradation. 28 Dynamic bonds with higher activity enable faster and more efficient network rearrangement, so that high healing performance is achieved. However, dynamic bonds with higher activity are easier to be affected by a high electrical field.…”

Design and characterization of molecular, crystal and interfacial structures of PVDF-based dielectric nanocomposites for electric energy storage

“…17 PTFE was first synthesized by Plunkett under autogenous pressure at 25 °C. 3 Subsequently, a large number of synthetic methods of PTFE including free radical polymerization, coordination polymerization, 18 electrochemical polymerization, 19 and plasma-type polymerization 20 were developed. Conventional radical polymerization was commonly used to synthesize PTFE polymers.…”

“…The development of sustainable, [1][2][3] low-cost 4,5 and eco-friendly power conversion 6,7 and storage systems [8][9][10] is an urgent demand for the exploitation of high-density polymer-based dielectric materials. The dramatic improvement of the dielectric permittivity and energy density of dielectric polymers is not only beneficial for reducing the volume and weight of energy storage and conversion devices, but also ensuring that large electrical machines can work under stable conditions.…”

Preparation of fluorinated epoxy‐phthalonitrile resins with excellent thermal stability and low dielectric constant

“…[14][15][16][17][18][19][20] The dielectric properties of fluorinated epoxy resins have also been studied, suggesting that it can be used in related industries such as electronic devices. [21][22][23] To achieve miniaturization and portability, the size of electronic devices continues to shrink, introducing new obstacles such as signal crosstalk, power consumption and time delays. Therefore, materials with low dielectric constants are expected to achieve faster and stable signal transmission in microelectronic devices.…”