Metallic glasses for biological applications and opportunities opened by laser surface texturing: A review

Lebrun, N.; Dupla, F.; Bruhier, H.; Prudent, M.; Borroto, A.; Der Loughian, C.; Bourquard, F.; Pelletier, J-M.; Rousseau, M.; Colombier, J.-P.; Pierson, J.-F.; Garrelie, F.; Steyer, P.

doi:10.1016/j.apsusc.2024.160617

Applied Surface Science

2024

DOI: 10.1016/j.apsusc.2024.160617

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Metallic glasses for biological applications and opportunities opened by laser surface texturing: A review

N. Lebrun,

F. Dupla,

H. Bruhier

et al.

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Cited by 2 publications

References 247 publications

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Ultra-fine quantitative removal of silicon materials by femtosecond laser

Chen,

Li,

Wei

et al. 2024

AIP Advances

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The development of miniaturized electronic devices is highly dependent on precision manufacturing techniques. To achieve device miniaturization, material removal and processing accuracy down to the submicrometer or even nanometer level are required. The precision machining of the mass block, a key component of the silicon micro-gyroscope, is taken as a reference. To achieve the precision positioning function of the micro-gyroscope, the mass at a certain position of the Si-based mass block must be precisely controlled. Therefore, the ultra-fine quantitative removal process of silicon materials is studied. A femtosecond laser processing system is constructed, and the evolution of micro–nanostructure and etching depth on the silicon surface is explored. An ultra-fine quantitative removal process is developed to achieve quantitative removal of different etching depths on the silicon surface. The experimental results show that the minimum removal thickness can be 0.502 µm. The processing index requirement for a silicon surface removal thickness of less than 0.001 mm has been fulfilled. It is critical to resolve the issue of high-quality manufacturing of miniaturized silicon-based devices.

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Ultra-fine quantitative removal of silicon materials by femtosecond laser

Chen,

Li,

Wei

et al. 2024

AIP Advances

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Review on Principal and Applications of Temporal and Spatial Beam Shaping for Ultrafast Pulsed Laser

Kim,

Choi

2024

Photonics

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Ultrafast or ultrashort pulsed lasers have become integral in numerous industrial applications due to their high precision, non-thermal interaction with materials, and ability to induce nonlinear absorption. These characteristics have expanded their use in microfabrication, semiconductor processing, automotive engineering, and biomedical fields. Temporal pulse shaping reduces laser pulse durations, often to shorter timescales than many physical and chemical processes, enabling greater control. Meanwhile, spatial shaping improves efficiency and precision in micro- and nanofabrication and biomedical applications. Advances in optical parametric amplifiers (OPAs) and chirped-pulse amplifiers (CPAs) have allowed for more refined temporal and spatial shaping, ensuring the preservation of high peak power while achieving ultrashort pulse durations. Additionally, spatial light modulators (SLMs) have facilitated sophisticated beam shaping, which, when combined with ultrafast lasers, supports applications like computer-generated holography and nanoscale fabrication. These developments underscore the growing utility and versatility of ultrafast lasers in both research and industrial contexts.

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Metallic glasses for biological applications and opportunities opened by laser surface texturing: A review

Cited by 2 publications

References 247 publications

Ultra-fine quantitative removal of silicon materials by femtosecond laser

Ultra-fine quantitative removal of silicon materials by femtosecond laser

Review on Principal and Applications of Temporal and Spatial Beam Shaping for Ultrafast Pulsed Laser

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