Micro channel cooled single emitter housing

Abstract

Rogers micro-channel coolers (MCC) cover a wide range of thermal management applications, such as laser diode heat sinks and CPU coolers. Apart from top-of-the-line thermal performance, some applications require a particularly homogeneous temperature distribution. In this paper, we present finite-element-method (FEM) simulation results of a new MCC stack setup for single emitter laser diodes and a solid copper heatsink reference with variable heat transfer coefficient (α) on the bottom side. Characteristic curves for temperature (T), temperature difference (ΔT) between optical components and pressure drop are shown as a function of α and flow rate. We find a ΔT of less than 2 K between the semiconductor elements and a total T reduction of >20 K compared to the reference heatsink.