2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) 2019
DOI: 10.1109/s3s46989.2019.9320506
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Microfluidic Cooling for 3D-IC with 3D Printing Package

Jun-Han Han
1
,
Karina Torres‐Castro
2
,
Robert E. West
3
et al.
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