Microstrip discontinuity compensation using DGS

Izadi, Omid Hoseini; Khalaj‐Amirhosseini, Mohammad

doi:10.1002/mmce.20688

Cited by 2 publications

(2 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The reference plane cut-out compensation technique, sometimes referred to as compensation using a defected ground structure (DGS), has been a topic of research in multiple papers that cover different case studies, such as individual SMA connector pads, track bends, etc. [6,7]. Individual reference plane cut-outs under the discontinuities can be shaped differently.…”

Section: Motivation and Existing Compensation Methodsmentioning

confidence: 99%

Applying Characteristic Impedance Compensation Cut-Outs to Full Radio Frequency Chains in Multi-Layer Printed Circuit Board Designs

Barzdenas,

Vasjanov

2024

Sensors

View full text Add to dashboard Cite

Modern wireless communication systems are of utmost importance to various sectors such as healthcare, education, the household, and the advancement of emerging technologies like the internet of things, autonomous vehicles, and the enhancement of 5G. Further development and improvement of these systems drives the need for small dimension, high integration and density, and cost-effective electronic devices. Achieving optimal performance in wireless electronic devices involves overcoming engineering challenges related to microstrip line signal integrity. This research addresses the impact of surface mount technology (SMT) component pads on signal integrity, proposing a novel high-frequency microstrip line structure for mitigating impedance discontinuities. The study introduces stepped microstrip lines and explores characteristic impedance compensation techniques. A six-layer printed circuit board (PCB) structure is presented, and the effects of compensation on signal integrity are analyzed using time-domain reflectometry and scattering parameter measurements. The results demonstrate the effectiveness of compensation methods in aligning characteristic impedance with desired values, thereby ensuring improved impedance matching and transmission coefficients. The average over-the-length impedance for the proposed structure with compensation applied was measured to be 52.7 Ω, which is only 1.3 Ω (2.5%) more than that of the reference microstrip. Applying reference plane cut-outs leads to a maximum compensated absolute value of more than 30 Ω to reach the target impedance with a 10% tolerance. This research contributes valuable insights for advancing wireless communication systems and maintaining robustness in high-frequency microstrip transmission lines.

show abstract

Section: Motivation and Existing Compensation Methodsmentioning

confidence: 99%

Applying Characteristic Impedance Compensation Cut-Outs to Full Radio Frequency Chains in Multi-Layer Printed Circuit Board Designs

Barzdenas,

Vasjanov

2024

Sensors

View full text Add to dashboard Cite

show abstract

“…However, few of them consider discontinuous structure of the TSV which will results in errors. In other previous works, microwave discontinuous structures [13,14,15] have been proposed, however these works are based on 2-D circuits. In 3D ICs, a TSV channel includes not only the TSV but also the pads.…”

Section: Introductionmentioning

confidence: 99%

Electrical analysis of TSV step change in radius with compensation structure

Zheng

Dong

Yang

et al. 2015

IEICE Electron. Express

View full text Add to dashboard Cite

Through silicon via (TSV) is a key technology in 3-D integrated circuits (3-D ICs). At the junction of TSV and pad, an extra loss produced by the discontinuous structure is inevitable in microwave circuit, and it can not be ignored. A compensation structure which can compensate the loss from step change in radius is proposed in this paper. The conventional structure and compensation structure are simulated by High Frequency Structure Simulator (HFSS). Simulation result shows that the proposed compensation structure can effectively reduce the return loss within the whole frequency range, and the compensation of insertion loss is more obvious at higher frequency. A series of top layer compensation structures with different diameter ratios are simulated. The simulation result shows that the larger the diameter ratio, the more obvious the compensation is. As the analysis based on the impedance model of TSV correlates well with the simulations, the proposed compensation structure is a worthwhile guideline for the design of 3-D ICs.

show abstract

Microstrip discontinuity compensation using DGS

Cited by 2 publications

References 7 publications

Applying Characteristic Impedance Compensation Cut-Outs to Full Radio Frequency Chains in Multi-Layer Printed Circuit Board Designs

Applying Characteristic Impedance Compensation Cut-Outs to Full Radio Frequency Chains in Multi-Layer Printed Circuit Board Designs

Electrical analysis of TSV step change in radius with compensation structure

Contact Info

Product

Resources

About