Microstructures and mechanical properties of ENIG/Sn-3.5Ag/ENIG joints formed by ultrasonic-assisted solder bonding

Kim, Hyeon Tae; Yoon, Jeong‐Won

doi:10.1016/j.jmrt.2023.04.097

Journal of Materials Research and Technology

2023

DOI: 10.1016/j.jmrt.2023.04.097

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Microstructures and mechanical properties of ENIG/Sn-3.5Ag/ENIG joints formed by ultrasonic-assisted solder bonding

Hyeon Tae Kim¹,

Jeong‐Won Yoon²

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2024

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Cited by 3 publications

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In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects

Liu

Paik

et al. 2024

Journal of Materials Science & Technology

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Microstructures and mechanical properties of ENIG/Sn-3.5Ag/ENIG joints formed by ultrasonic-assisted solder bonding

Cited by 3 publications

References 34 publications

In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects

In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects

Ultrasonic-assisted soldering of SiC ceramic and aluminum alloy with a commercial inactive Sn3.0Ag0.5Cu solder

Ni mesh-reinforced ultrasonic-assisted Cu/Sn58Bi/Cu joint performance: Experiments and first-principles calculations

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