Microwave-assisted activation for electroless nickel plating on PMMA microspheres

Chen, Yen‐Chung; Liu, Robert Lian-Huey; Chen, Xinliang; Shu, Hsiou-Jeng; Ger, Ming-Der

doi:10.1016/j.apsusc.2011.02.113

Cited by 22 publications

(11 citation statements)

References 28 publications

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“…13,34,35 Meanwhile, it is used in various fields with structures such as nanoparticles and nanowires. [36][37][38][39][40] Electrodeposition, 41 chemical plating, 42 layer-by-layer (LBL) self-assembly, 16,43,44 and in situ reduction 45,46 have been proposed to prepare polymer/mental complexes. Among these methods, chemical plating is a simple, convenient, and industrial method for nuclear cladding.…”

Section: Introductionmentioning

confidence: 99%

Shell structure control of monodisperse polystyrene‐silver composite microspheres and synthesis of epoxy resin‐based anisotropic conductive adhesives

Liu

et al. 2023

Polymers for Advanced Techs

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Monodisperse polystyrene-silver (PS-Ag) composite microspheres were used to enhance the electrical conductivity of epoxy resin-based anisotropic conductive adhesives (ACAs). Specially designed PS-Ag composite microspheres were used as conductive elements to construct anisotropic conductive arrays. In addition, the surface microstructure and morphology of PS-Ag composite microspheres were controlled by adjusting the silver precursor concentration and implemented electroless plating method. The size and conductivity of the final composite microspheres used for ACAs were 2.572 μm and 81,967 S cm À1 , respectively. In addition, diglycidyl ether of bisphenol-A (DGEBA) epoxy resin and polyamide resin were used as the matrix resin and curing agent, respectively, to predict the optimum curing process parameters based on curing kinetics. Based on this premise, carboxyl-terminated butadiene-acrylonitrile (CTBN) and PS-Ag composite microspheres were used as the toughening agent and conductive filler, respectively, and a facile strategy was developed to prepare ACAs (viz., PS-Ag/Ep-ACAs). As the PS-Ag composite microspheres exhibited a submicron structure, PS-Ag/Ep-ACAs creatively exhibited satisfactory anisotropic electrical and mechanical properties. Therefore, the research strategy and fabrication methods proposed demonstrate immense potential for the fabrication of large-scale ACAs in practical applications.

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Section: Introductionmentioning

confidence: 99%

Shell structure control of monodisperse polystyrene‐silver composite microspheres and synthesis of epoxy resin‐based anisotropic conductive adhesives

Liu

et al. 2023

Polymers for Advanced Techs

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“…Recent studies have shown that metallizing the surface of insulating polymeric substrates is an important strategy for achieving ultrathin and ultra-efficient EMI SE performance [14,15]. To date, numerous surface metallization methods have been conducted to fabricate EMI shielding materials, including vapor deposition, electroless deposition [16,17], magnetron sputtering [18], and electroless plating [19,20].…”

Section: Introductionmentioning

confidence: 99%

Highly Bendable and Durable Waterproof Paper for Ultra-High Electromagnetic Interference Shielding

Ren

Guo

et al. 2019

Polymers

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An efficient electromagnetic interference (EMI) shielding paper with excellent water repellency and mechanical flexibility has been developed, by assembling silver nanowires (AgNWs) and hydrophobic inorganic ceramic on the cellulose paper, via a facile dip-coating preparation. Scanning electron microscope (SEM) observations confirmed that AgNWs were interconnected and densely coated on both sides of the cellulose fiber, which endows the as-prepared paper with high conductivity (33.69 S/cm in-plane direction) at a low AgNW area density of 0.13 mg/cm2. Owing to multiple reflections and scattering between the two outer highly conductive surfaces, the obtained composite presented a high EMI shielding effectiveness (EMI SE) of up to 46 dB against the X band, and ultrahigh specific EMI SE of 271.2 dB mm–1. Moreover, the prepared hydrophobic AgNW/cellulose (H-AgNW/cellulose) composite paper could also maintain high EMI SE and extraordinary waterproofness (water contact angle > 140°) by suffering dozens of bending tests or one thousand peeling tests. Overall, such a multifunctional paper might have practical applications in packaging conductive components and can be used as EMI shielding elements in advanced application areas, even under harsh conditions.

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“…It is well known that electroless plating with advantage of low cost, simple process, high shielding efficiency of coating, excellent environment stability and other notable features is widely applied in preparation of metal composites [12][13][14][15][16]. In recent years, various microwave absorption materials were prepared by electroless plating technology [17][18][19][20][21][22][23][24].…”

Section: Introductionmentioning

confidence: 99%

Microwave absorption property of Ni–Co–Fe–P-coated flake graphite prepared by electroless plating

Yang¹,

Fu²,

An³

et al. 2012

Journal of Alloys and Compounds

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Microwave-assisted activation for electroless nickel plating on PMMA microspheres

Cited by 22 publications

References 28 publications

Shell structure control of monodisperse polystyrene‐silver composite microspheres and synthesis of epoxy resin‐based anisotropic conductive adhesives

Shell structure control of monodisperse polystyrene‐silver composite microspheres and synthesis of epoxy resin‐based anisotropic conductive adhesives

Highly Bendable and Durable Waterproof Paper for Ultra-High Electromagnetic Interference Shielding

Microwave absorption property of Ni–Co–Fe–P-coated flake graphite prepared by electroless plating

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