2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems 2012
DOI: 10.1109/epeps.2012.6457912
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Millimeter-wave coplanar interconnects and radiators on FR-4 laminates

Supreetha Rao Aroor
1
,
Richard G. Pierce
2
,
Rashaunda Henderson
3
et al.
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Cited by 4 publications
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Broadband integration using FR-4 to silicon CPW-to-CPW transition

Aroor
1
,
Pierce
2
,
Blanchard
3
et al. 2014
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems
2
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Broadband integration using FR-4 to silicon CPW-to-CPW transition

Aroor
1
,
Pierce
2
,
Blanchard
3
et al. 2014
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems
2
0
0
0
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Considerations for the use of low-cost substrates for MM-wave packaging

Aroor
1
,
Henderson
2
2013
2013 Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS)
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Broadband millimeter wave modified aperture bowtie antenna-in-package

Pierce
1
,
Aroor
2
,
Blanchard
3
et al. 2013
2013 Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS)
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