Miniature loop heat pipes for electronics cooling

Pastukhov, Vladimir G.; Maidanik, Yu. F.; Vershinin, C.V.; Korukov, M.A.

doi:10.1016/s1359-4311(03)00046-2

Cited by 209 publications

(78 citation statements)

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“…• Reducing the wall thickness, up to 0.25 mm for a cylindrical E/CC in Stainless Steel (Pastukhov et al, 2003). The wall thickness depends on the shape and the material of the evaporator, in particular to prevent a deformation of the container under the pressure force of the working fluid.…”

Section: Evaporator/compensation Chamber (E/cc)mentioning

confidence: 99%

State-of-the-Art Experimental Studies on Loop Heat Pipes

Launay¹,

Vallée²

2011

Frontiers in Heat Pipes

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The present study provides a concise overview of the main feature evolution of Loop Heat Pipe (LHP) designs, in particular on the evaporator/compensation chamber, based on experimental studies published between 1998 and 2010. It presents a synthesis of results on LHP performances at steady-state, and observations related to the LHP dynamic behaviours, as start-up or oscillating behaviours. The objective of this review is to gather as much information from the LHP experimental studies so as to provide a database, and thus promote the development of tools for understanding and predicting the LHP behaviors. The review shows some omissions in the LHP description and in the results presentation that makes these data difficult to use for further studies. This review should promote some coordination for future experimental works on LHP.

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Section: Evaporator/compensation Chamber (E/cc)mentioning

confidence: 99%

State-of-the-Art Experimental Studies on Loop Heat Pipes

Launay¹,

Vallée²

2011

Frontiers in Heat Pipes

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“…Generally speaking of a PC (a desktop or a notebook), it is important to maintain the operation temperature of the central processing unit (CPU) below a certain level, otherwise the PC reliability is compromised [1]. Miniature heat pipe coolers fitted with a heat sink are an optimum choice, taking into account both cost and performance, due to their simple structure, lack of active elements needed for working fluid transport and high efficiency of heat transfer [2][3][4][5][6][7][8][9][10][11].…”

Section: Introductionmentioning

confidence: 99%

“…The challenge of CPU cooling consists of restricting its temperature to 60-90 0 C at a heat sink temperature of 35-45 0 C [9]. A heat pipe itself cannot provide the cooling.…”

Section: Introductionmentioning

confidence: 99%

“…It is defined as the temperature difference between the evaporator and the heat sink divided by the dissipated heat flow rate, Q. The total thermal resistance is a function of a large number of variables, such as heat pipe geometry and material, wick structure, working fluid properties, evaporator and condenser length [2,4,[8][9][10][11]. There are several types of wick structures, e.g.…”

Section: Introductionmentioning

confidence: 99%

“…Water, ammonia, acetone, propane and toluene are usually used as working fluids. The temperature difference between evaporator and heat sink increases with heat flow rate, Q, whereas the total thermal resistance decreases with Q [2,[8][9][10]. Thermal performance of a heat pipe, expressed by high values of Q, is improved at large values of diameter and inclination angle as well as at low values of length and wall thickness [8,11].…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Characterization of cooling systems based on heat pipe principle to control operation temperature of high-tech electronic components

Dobre

Pârvulescu

Stoica

et al. 2010

Applied Thermal Engineering

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To cite this version:Tănase Dobre, Anicuţa Stoica, Gustav Iavorschi, Oana Cristina Pârvulescu.Characterization of cooling systems based on heat pipe principle to control operation temperature of hightech electronic components. Applied Thermal Engineering, Elsevier, 2010, 30 (16) This is a PDF file of an unedited manuscript that has been accepted for publication. As a service to our customers we are providing this early version of the manuscript. The manuscript will undergo copyediting, typesetting, and review of the resulting proof before it is published in its final form. Please note that during the production process errors may be discovered which could affect the content, and all legal disclaimers that apply to the journal pertain. AbstractThe use of cooling systems based on heat pipe principle to control operation temperature of electronic components is very efficient. They have an excellent miniaturizing capacity and this fact creates adaptability for more practical situations.Starting from the observation that these cooling systems are not precisely characterized from the thermal efficiency point of view, the present paper proposes a methodology of data acquisition for their thermal characterization. An experimental set-up and a data processing algorithm are shown to describe the cooling of a heat generating electronic device using heat pipes. A Thermalright SI-97 PC cooling system is employed as a case-study to determine the heat transfer characteristics of a fins cooler.

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Analysis of superheated loop heat pipes exploiting nanoporous wick membranes

2013

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The design and analysis of plant-inspired loop heat pipes (LHPs) that would exploit nanoporous membranes to allow for operation with large capillary pressures and superheated liquid are presented. The operating concepts of this superheated loop heat pipe (SHLHP) resemble the transpiration process in vascular plants: reduction of pressure in leaves drives sap flow up from the roots and overcomes gravity, viscous drag, and reduced chemical potential of water in subsaturated soils. We present a model for steady-state operation and a linear response analysis of both the conventional and superheated designs. Our analysis shows that these SHLHPs could: (1) extend the limitations of conventional LHPs imposed by thermodynamic properties of the working fluid, (2) provide efficient heat transfer over long distances and against large accelerations, and (3) allow for operation in a subsaturated state that would eliminate the thermal resistance and entrainment effect of the liquid film of conventional designs. V C 2013 American Institute of Chemical Engineers AIChE J, 60: [762][763][764][765][766][767][768][769][770][771][772][773][774][775][776][777] 2014

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Miniature loop heat pipes for electronics cooling

Cited by 209 publications

References 0 publications

State-of-the-Art Experimental Studies on Loop Heat Pipes

State-of-the-Art Experimental Studies on Loop Heat Pipes

Characterization of cooling systems based on heat pipe principle to control operation temperature of high-tech electronic components

Analysis of superheated loop heat pipes exploiting nanoporous wick membranes

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