Mode-decomposition-based Equivalent Via (MEV) Model and MEV Model Application Range Analysis

Li, Chaofeng; Cai, Kevin; Ouyang, Muqi; Mathew, Manish Kizhakkeveettil; Mousav, Mehdi; Sen, Bidyut; Kim, DongHyun

doi:10.1109/apemc57782.2023.10217672

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Mode-decomposition-based Equivalent Via (MEV) Model and MEV Model Application Range Analysis

Cited by 4 publications

References 5 publications

Vertical Interconnect Technology in Silicon, Package, and Printed Circuit Board (PCB) with Coaxial Structure

Vertical Interconnect Technology in Silicon, Package, and Printed Circuit Board (PCB) with Coaxial Structure

High-Speed Differential Via Optimization using a High-Accuracy and High-Bandwidth Via Model

A Novel Vertical Conductive Structure for Printed Circuit Boards and its Scalable Model

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