Modeling and Optimization of Cooling System for High Power Slab Laser Amplifiers

With the power level of diode-pumped solid-state laser (DPSSL) rising continuously, its thermal effect has become the main problem limiting the laser performance. In this paper, based on the heat distribution of diode partially end-pumped slab (Innoslab) laser, a shunt rectangular microchannel heat sink with locally enhanced heat dissipation is designed. Firstly, multi-stage parallel short channels are designed in the heat concentration area to enhance the solid-liquid heat exchange in this area, and the effects of structure and working conditions on its heat dissipation performance are investigated. Secondly, the copper layer is introduced into the end face of the low thermal conductivity crystal to form a high thermal conductivity path, which alleviates the heat accumulation inside the crystal. Under a certain condition, compared with the traditional liquid-cooled plate system, the maximum temperature of the laser crystal is reduced from 169.62 to 118.18 °C, the pressure drop is reduced by 66.75%, and the total mass of the system is reduced to 4.87% of the original system, which effectively improves the practical performance of the device.

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Microchannel Heat Sink with High Thermal Conductivity Path for Diode Partially End-Pumped Slab Laser

Guo

Sun

et al. 2021

J. Phys.: Conf. Ser.

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The thermal effect of diode pumped solid-state laser (DPSSL) has always been a main problem limiting the further improvement of laser performance. In this paper, based on the special heat load distribution of the laser crystal of diode partially end-pumped slab (Innoslab) laser, a multi-stage manifold rectangular microchannel heat sink (MCHS) with high thermal conductivity path (HTCP) is designed. The multi-stage manifold provides the MCHS more fluid-solid heat transfer area near the heat gathering area, while the HTCP provides a path for heat transmission from pump end to the body of MCHS. According to simulation calculation, the highest temperature of laser crystal has been reduced by nearly 50? due to the addition of HTCP. Then the MCHS is fabricated by MEMS technology and the laser crystal is replaced by simulated heat source. Compared with the MCHS without the HTCP, the thermal resistance of the MCHS with HTCP is reduced by 6.4%, which proves the effectiveness of HTCP in heat dissipation of Innoslab laser crystal.

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Modeling and Optimization of Cooling System for High Power Slab Laser Amplifiers

Cited by 5 publications

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A modified model for the LD pumped 2μm Tm:YAG laser: Thermal behavior and laser performance

A modified model for the LD pumped 2μm Tm:YAG laser: Thermal behavior and laser performance

Design and simulation of locally enhanced microchannel heat sink for diode partially pumped slab laser

Microchannel Heat Sink with High Thermal Conductivity Path for Diode Partially End-Pumped Slab Laser

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