2024 IEEE International Conference on Engineering, Technology, and Innovation (ICE/ITMC) 2024
DOI: 10.1109/ice/itmc61926.2024.10794396
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Modeling and Simulation of Curing Cycle of Thermoset Epoxy Resin: Comparison of OpenFOAM Solver and Licensed Simulation Software

Jaume Sempere Torregrosa,
Harrison De La Rosa RamíRez,
Leonardo Cosma
et al.
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