2012 IEEE National Aerospace and Electronics Conference (NAECON) 2012
DOI: 10.1109/naecon.2012.6531048
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Modeling and simulation of packaging substrate effects on radio frequency integrated circuits

Abstract: In this paper an analysis of the effects of integrated circuit packaging substrates on a radio frequency (RF) IC is presented. At RF frequencies the effects of packaging parasitics become crucial when assembling an RF system in package (SiP) or integrating a single die with a package. A differential buffer, which had been previously fabricated in a 90nm CMOS process is used as a vehicle to analyze the effects of packaging on performance. The integration of the buffer die with the package is modeled and analyze… Show more

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