Modeling Effect of Grain Orientation on Degradation in Tin-Based Solder: I. Current-Driven Diffusion

Zhang, Yuanxiang; Ni, Jiamin; Liu, Yong; Maniatty, Antoinette M.

doi:10.1109/tcpmt.2018.2886813

IEEE Trans. Compon., Packag. Manufact. Technol.

2019

DOI: 10.1109/tcpmt.2018.2886813

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Modeling Effect of Grain Orientation on Degradation in Tin-Based Solder: I. Current-Driven Diffusion

Yuanxiang Zhang

Jiamin Ni

Yong Liu

et al.

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Cited by 3 publications

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Anisotropy-induced reliability issues and grain orientation control in Sn-based micro solder joints for advanced packaging

Qiao,

Zhao

2024

Journal of Materials Science & Technology

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Modeling Effect of Grain Orientation on Degradation in Tin-Based Solder: I. Current-Driven Diffusion

Cited by 3 publications

References 26 publications

Anisotropy-induced reliability issues and grain orientation control in Sn-based micro solder joints for advanced packaging

Anisotropy-induced reliability issues and grain orientation control in Sn-based micro solder joints for advanced packaging

Modeling Effect of Grain Orientation on Degradation in Tin-Based Solder—Part II: Electromigration Experiments

Insights Into the Grain Orientation Effect on Electromigration-Induced Failure in Solder Interconnects Through Phase Field Modeling

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