Mold Bleed Effacing On Leaded Package with Intentional Coining Concept in Transfer Molding Process Applications

Hazizan, Asyraq; Koo, Chee Aung; Jamal, Fakhrul Izzat

doi:10.1109/eptc59621.2023.10457884

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) 2023

DOI: 10.1109/eptc59621.2023.10457884

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Mold Bleed Effacing On Leaded Package with Intentional Coining Concept in Transfer Molding Process Applications

Asyraq Hazizan,

Chee Aung Koo,

Fakhrul Izzat Jamal

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Mold Bleed Effacing On Leaded Package with Intentional Coining Concept in Transfer Molding Process Applications

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