Molecular Dynamics Study on Tensile Strength of Ni-10Cu Alloy with Pre-existing Σ3 Grain Boundary

Dora, T. L.; Singh, Sandeep Kumar; Verma, Akarsh; Mishra, Radha Raman

doi:10.1007/978-981-97-3874-8_17

Lecture Notes in Mechanical Engineering

2024

DOI: 10.1007/978-981-97-3874-8_17

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Molecular Dynamics Study on Tensile Strength of Ni-10Cu Alloy with Pre-existing Σ3 Grain Boundary

T. L. Dora,

Sandeep Kumar Singh,

Akarsh Verma

et al.

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Molecular Dynamics Study on Tensile Strength of Ni-10Cu Alloy with Pre-existing Σ3 Grain Boundary

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References 48 publications

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