Nano-structured electromagnetically-active adhesives for innovative assembling-disassembling technologies

Abstract

The development of efficient and reversible bonding technologies offer cost reduction, resistance to applied load, easy and rapid dismantling and smart recycling processes. Different concentrations of electromagnetically-active fillers were embedded in the thermoplastic matrix of provisional hot-melt adhesives and tested to assess their thermal behaviour under broadband electromagnetic fields. A power radiofrequency system was used to study the joining features vs. exposure time for different compositions and frequencies. Positive conclusions of tests were emphasized on the way of prototyping the innovative joining technology for automotive industry.