Nanofluid as a coolant for electronic devices (cooling of electronic devices)

Ijam, Ali; Saidur, R.

doi:10.1016/j.applthermaleng.2011.08.032

Cited by 233 publications

(68 citation statements)

References 18 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Nanofluid is a potential coolant for heat transfer application such as fuel cell thermal management and electronic device cooling and automobile sector [13]. The presence of nanoparticles in the base fluid increase the thermal conductivity behaviour.…”

Section: Resultsmentioning

confidence: 99%

Effects of Milling Parameters on Rheological Behaviours of Silica Nanofluid Prepared by Two-Step Process

Davis¹,

Joy²,

Singh³

2017

Asian J. Chem.

View full text Add to dashboard Cite

Nanofluids have garnered the attention of material science and heat transfer fraternity across the world for the reported enhancement of their thermal properties and the amenability for a change of their rheological properties under external influence. Of the various nanofluids that have been studied widely, nano-silica fluids comprise a predominant fraction. The alterations in the morphological characteristics of the nano-silica fluids brought about by mechanical treatment of the samples influence their chemical and rheological behaviours. The present work involves the study of milling parameters on the rheological behaviours of silica particles. The micron size silica is reduced to nano size by ball milling, done by 0-20 h at 300 rpm in Fritsch P5 planetary ball mill. This milled powder will be characterized by XRD and SEM for it crystallite size and morphology. Thus prepared silica on treatment with ethylene glycol and water mixture enhances its dispersion in fluids.

show abstract

Section: Resultsmentioning

confidence: 99%

Effects of Milling Parameters on Rheological Behaviours of Silica Nanofluid Prepared by Two-Step Process

Davis¹,

Joy²,

Singh³

2017

Asian J. Chem.

View full text Add to dashboard Cite

show abstract

“…The presented background study predominantly indicates that the knowledge on nanofluid as an effective coolant [126][127][128][129] as well as an erosive material 125 is still at its early stages. In other words, the phenomenon of natural and mixed convection heat transfer of nanofluids in turbulent flow regime is not well understood.…”

Section: Inside Cavities and Enclosuresmentioning

confidence: 99%

A survey on experimental and numerical studies of convection heat transfer of nanofluids inside closed conduits

Safaei

Shadloo

Goodarzi

et al. 2016

Advances in Mechanical Engineering

106

View full text Add to dashboard Cite

Application of nanofluids in heat transfer enhancement is prospective. They are solid/liquid suspensions of higher thermal conductivity and viscosity compared to common working fluids. A number of studies have been performed on the effect of nanofluids in heat transfer to determine the enhancement of properties in addition to rearrangement of flow passage configurations. The principal objective of this study is to elaborate this research based on natural, forced, and the mixed heat transfer characteristics of nanofluids exclusively via convection for single-and two-phase mixture models. In this study, the convection heat transfer to nanofluids has been reviewed in various closed conduits both numerically and experimentally.

show abstract

“…Parameters like hydraulic diameter and other dimensionless correlations for Reynolds number, Prandtl number and Nusselt number are consideredunder the assumption of single phase, constant thermal properties applicablefor laminar and turbulent flows in order to analyze the efficiency of MCHS by applying nanofluids to achieve the heat dissipation capability [16,17]. The heat transfer coefficient is calculated by using:…”

Section: B Microchannel Heat Sink (Mchs)mentioning

confidence: 99%

Performance Analysis of Electronics Cooling using Nanofluids in Microchannel Heat Sink

Fesal¹,

SyazwaniIlmin²,

Gani³

2016

IJET

View full text Add to dashboard Cite

Abstract-Performance analysis of thermal enhancement for cooled microchannel heat sink (MCHS) using nanofluidsmathematical formulation was investigated and presented in this paper. Heat transfer capability in terms of thermal conductivity, heat transfer coefficient, thermal resistance, heat flux and required pumping power were evaluated on the effectiveness of copper oxide (CuO), silicon dioxide (SiO 2 ) and titanium dioxide (TiO 2 ) with water as a base fluid. The results showed that thermal performance augmented by 12.2% in thermal conductivity at particle volume fraction of 4% to CuO-water nanofluid, 11.8% for SiO 2 -water and 10.0% for TiO 2 -water. The maximum heat transfer coefficient enhances of 12.4% for CuO, SiO 2 is 8. In the last three decades, the emergence of nanotechnologyis rapidly approaching, were utilized to improve the heat transfer rate to apply on the electronicdevices in order to reach a satisfactory level of thermal efficiency. The heat transfer rate can passively be improved by changing the geometry's flow, boundary conditions or by improving thermo physical properties such as increasing the thermal conductivity of fluid [1]. To meet the high dissipation rate requirements and maintain a low junction temperature in electronic devices, many cooling technologies have been pursued. Among of these, the microchannel heat sink (MCHS) was introduced because of its ability to produce high heat transfer coefficient, small size and volume per heat load and small coolant requirements [2].Working fluids was applied to enhance the heat transfer by changing the fluid transport properties and flow features in MCHS. Recently, this concept has focused on heat transfer enhancement by using a nanofluid that has a nanoscale metallic or non-metallic particles in the base fluids.Besides, nanofluids has become a concern because they display higher potential as heat transfer fluid than normally utilized base fluids and micron sized particle-fluids. This is due to clogging in pumping and flow apparatus which is caused by rapid settling of the micron sized particle. Nanofluids do not indicate this behavior. This makes nanofluids a better choice as heat transfer fluid [3]. Nanofluids (1-100nm-size particles), often called as ultra-fine solid particles, engineered colloidal suspension, are stable and prepared by dispersing a certain percentage of nanoparticles in base fluids [4][5][6].The factors that causes heat transfer enhancement are solid particles and host fluids chemical composition, size, shape and concentration of nanoscale particles, thermal condition and surfactants. Some of these factors also affect the stability of the nanofluids. There are three strategies to attain good stability, namely addition of surfactants, pH control and ultrasonification [7]. From the literature, heat transfer coefficient depends on Reynolds number, volume fraction of the nanofluids (concentration), temperature, base-fluid

show abstract

Nanofluid as a coolant for electronic devices (cooling of electronic devices)

Cited by 233 publications

References 18 publications

Effects of Milling Parameters on Rheological Behaviours of Silica Nanofluid Prepared by Two-Step Process

Effects of Milling Parameters on Rheological Behaviours of Silica Nanofluid Prepared by Two-Step Process

A survey on experimental and numerical studies of convection heat transfer of nanofluids inside closed conduits

Performance Analysis of Electronics Cooling using Nanofluids in Microchannel Heat Sink

Contact Info

Product

Resources

About