Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2014
DOI: 10.1109/itherm.2014.6892295
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Nanoporous evaporative device for advanced electronics thermal management

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Cited by 22 publications
(12 citation statements)
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“…By supplying liquid from the cross-plane direction of the membrane and reducing the membrane thickness, the liquid transport flow length is decreased to lower the viscous drag without significantly affecting the heat transfer and capillary force. Enhanced heat transfer performances have been predicted [33,34] and demonstrated [35][36][37].…”
Section: Introductionmentioning
confidence: 96%
“…By supplying liquid from the cross-plane direction of the membrane and reducing the membrane thickness, the liquid transport flow length is decreased to lower the viscous drag without significantly affecting the heat transfer and capillary force. Enhanced heat transfer performances have been predicted [33,34] and demonstrated [35][36][37].…”
Section: Introductionmentioning
confidence: 96%
“…The industry has called for innovative cooling technologies to respond to these issues . Integrated microfluidics and two-phase cooling have been proposed as potential solutions; however they require a cooling fluid and complicated changes to current layouts and manufacturing processes. The inherent compatibility and simplicity of solid-state thin-film thermoelectric devices with conventional CMOS makes μTECs a promising alternative.…”
Section: Introductionmentioning
confidence: 99%
“…Evaporation from nanopores is essential for plant transpiration , and has inspired a variety of technologies in diverse areas including electronics cooling, steam generation, water desalination, and power generation. , To further develop nanopore-evaporation-based technologies and achieve their ultimate performance, it is critical to understand the ultimate mass-transport-limited process involved. Evaporation from nanopores consists of three mass transport processes, i.e., liquid/vapor transport to/from the liquid–vapor interface, as well as liquid vaporization at the liquid–vapor interface.…”
mentioning
confidence: 99%