New Fluoropolymers Having Both Low Water Uptake and a Low Dielectric Constant

Abstract

Polymers with both low water uptake and a low dielectric constant have seen interest from both the electronic and microelectronic industries for several years. They play a crucial role in maintaining the good operating situation of devices, whereas most other materials are unsatisfactory. In this contribution, two new fl uoropolymers are reported, which are derived from the thermo-crosslinking reaction of functional monomers containing perfl uorocyclobutane and benzocyclobutene moieties. These polymers show water uptake ranging from 0.11 to 0.31% after immersion in boiling water (near 98 °C) for 96 h, and exhibit dielectric constants ( k ) of below 2.4 at a range of frequencies from 0.1 MHz to 30 MHz. In contrast, a comparative polymer without perfl uorocyclobutane units has a k value of more than 2.70 and water uptake of 0.67%, respectively, suggesting that the low water absorption and dielectric constants of the fl uoropolymers can be attributed to the existence of perfl uorocyclobutane groups in the molecular backbone. These results also indicate that the properties of the fl uoropolymers are superior to these of the most commercial polymeric low-k materials, implying that these fl uoropolymers could be used as the varnish for enameled wire in the electrical industry and as encapsulation resins in the microelectronics industry.

Synthesis and characterization of a biphenyl perfluorocyclobutyl (BP‐PFCB) polyethylene glycol (PEG) blend compatibilizer

“…PFCB aryl ether polymers are typically amorphous because of the stereorandom head-to-head formation of the PFCB linkage. PFCB aryl ether polymers have been investigated for a broad range of applications including microelectronics, [11][12][13] protonexchange membrane fuel cells (PEMFCs), [14] and polymer light emitting diode (PLEDs). [15,16] Polymeric blending is a highly effective method to combine properties and are typically faster than modular approach utilized in PFCB aryl ether polymers.…”

Preparation of planar and hydrophobic benzocyclobutene‐based dielectric material from biorenewable rosin

“…With the development of microelectronics, the sizes of individual devices have become progressively smaller. Scaling down generates problems such as interconnect signal delay (RC delay) that gives rise to propagation delay, crosstalk noise, and power dissipation . These problems have become an obstacle to further development within the microelectronics.…”

“…The use of interconnect materials with low dielectric constant is one effective way to reduce RC delay . Therefore, the development of materials with low dielectric constant has received widespread attention . One method for decreasing the dielectric constant is to prepare porous materials because the dielectric constant of air is approximately 1.…”

A New Four‐Arm Organosiloxane with Thermopolymerizable Trifluorovinyl ether Groups: Synthesis and Conversion to the Polymer with both Low Dielectric Constant and Low Water Uptake

“…High‐quality sealants should have both low dielectric constant and low water uptake. However, the commercial sealants, which meet this requirement, are rare . Undoubtedly, further development of these materials with both low k and low water uptake is desirable.…”