“…Within materials science, research on the lead-free solders, which are developed on the basis of Sn as one of the main components, has been the focus of studies of Cu 3 Sn (Suganuma, 2001). Due to the strong driving force towards miniaturization, the impact of intermetallic compounds such as Cu 3 Sn on the short-and long-term stability of the solder joint has been studied extensively (Tu, 1973(Tu, , 1996(Tu, , 2007Tu & Thompson, 1982;Bader et al, 1995;Harris & Chaggar, 1998;Warwick & Muckett, 1983;Sunwoo et al, 1992;Yoon et al, 2003;Plumbridge, 2007;Wang et al, 2010;Gao & Qu, 2012;Yang et al, 2013;Tsai et al, 2010;Paul et al, 2011;Cheng et al, 2012). Outside the soldering community, Cu 3 Sn has gained interest as a non-noble metallic oxidation catalyst.…”