Newly developed integration method for biomedical implants using flexible polymer cable

Cheng, M.; Lim, Li Shiah; Paing, Myo; Yu, Aibing

doi:10.1109/eptc.2010.5702669

Cited by 3 publications

(3 citation statements)

References 7 publications

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“…The dimensions of the AuSn solder bump are 60 μm × 60 μm × 50 μm. As shown in figure 6(g), the micro-fabricated flexible PI cable [24] is used to exchange the recorded neural signal and the power supply voltages between two ASIC chips. The thickness and length of the PI cable are 10 μm and 20 mm, respectively.…”

Section: Assembly Processmentioning

confidence: 99%

A low-profile three-dimensional neural probe array using a silicon lead transfer structure

Cheng

Tan

et al. 2013

J. Micromech. Microeng.

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This paper presents a microassembly method for low-profile three-dimensional probe arrays for neural prosthesis and neuroscience applications. A silicon (Si) lead transfer structure, Si interposer, is employed to form electrical connections between two orthogonal planes-the two dimensional probes and the dummy application-specific integrated circuit (ASIC) chip. In order to hold the probe array and facilitate the alignment of probes during assembly, a Si platform is designed to have through-substrate slots for the insertion of probes and cavities for holding the Si interposers. The electrical interconnections between the probes and the dummy ASIC chip are formed by solder reflow, resulting in greatly improved throughput in the proposed assembly method. Moreover, since the backbone of the probe can be embedded inside the cavity of the Si platform, the profile of the probe array above the cortical surface can be controlled within 750 μm. This low-profile allows the probe array not to touch the skull after it is implanted on the brain. The impedance of the assembled probe is also measured and discussed.

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Section: Assembly Processmentioning

confidence: 99%

A low-profile three-dimensional neural probe array using a silicon lead transfer structure

Cheng

Tan

et al. 2013

J. Micromech. Microeng.

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“…The ASIC is then secured onto the platform for the wirebonding process. After completing the wirebonding between the interface IC and platform, the device will proceed with another round of wirebonding process to intergate the flexible cable [4] and Si platform. Figure 3 shows the assembled probe array before wirebonding.…”

Section: Assembly and Integration Processmentioning

confidence: 99%

Evaluation and Characterization of Reliable Packaging Method for Neuromotor Prosthetic Device

Tan

Lim

Yee

et al. 2013

AMR

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Neural probe array is used for neural recording and simulation applications. It will be implanted into the motor cortex of a paralytic human to control robotic arm and perform tasks such as grasping an object. The major components are silicon (Si) probes, Si platform, application-specific integrated circuit (ASIC), polyimide flexible cable and wireless IC. In-plane Si probes are inserted into the Si platform to form a three-dimensional (3D) probe array. Wirebonding technique is used to integrate the ASIC and the probe array. Pad finishes play an important role in wire bonding as it would affect the reliability of the electrical connections. As such, the focus of the paper will be on the evaluation and characterization of an electroless nickel immersion gold (ENIG) pad finishing and its bonding parameters for wirebonding application. ENIG pad having a 0.1-µm gold (Au) thickness combined with an additional Au stud and wirebonding temperature of 200 °C are found to have comparable wirebonding capabilities as a 0.3-µm thick Au finishing pad. The wire pull test result and SEM observation between the ENIG and Au finishing pad at different bonding parameters were presented and discussed.

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“…It needs to be integrated using a cable [4], providing electrical and mechanical connection to integrated circuits (ICs) for recording the neural signals and sending to an external computer for analysis. There are previous works being carried out in such implantable integrated neural probe array, such as Michigan probe [5] and Utah probe [6].…”

Section: Introductionmentioning

confidence: 99%

Integration of low profile neural probe array with flexible polyimide cable

Ling

Cheng

Giao

et al. 2011

2011 IEEE 13th Electronics Packaging Technology Conference

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In this work, an integration method of low profile probe array system is proposed for minimizing the tissue trauma after implantation. The planar neural probes was assembled with a Si platform to form a 3D probe array, which is then connected to the application-specific integrated circuit (ASIC) chip with a flexible polyimide cable by flip-chip bonding to complete the whole integration. The probe array and flexible polyimide cable have undergone electrical tests to prove to be highly stable and reliable. With the specially designed components, flexible assembly is achieved. The proposed integration method achieved a low profile of the probe array and the requirements for its applications. The impedance of the assembled probe electrode in artificial cerebrospinal fluid (aCSF) is measured to be about 1.1 MΩ at 1kHz.

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Newly developed integration method for biomedical implants using flexible polymer cable

Cited by 3 publications

References 7 publications

A low-profile three-dimensional neural probe array using a silicon lead transfer structure

A low-profile three-dimensional neural probe array using a silicon lead transfer structure

Evaluation and Characterization of Reliable Packaging Method for Neuromotor Prosthetic Device

Integration of low profile neural probe array with flexible polyimide cable

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