Next Gen Laser Assisted Bonding (LAB) Technology

Na, SeokHo; Gim, MinHo; Kim, ChoongHoe; Park, DongHyeon; Ryu, Dongsu; Park, DongJoo; Khim, JinYoung

doi:10.1109/ectc51906.2022.00313

Cited by 9 publications

(1 citation statement)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…However, the heat exposure time was very short and localized, and thus, damage to the silicon chip was expected to be very minimal. That is why LAB technology recently started to be used in semiconductor packaging [ 25 ] and micro LED packaging [ 26 ].…”

Section: Resultsmentioning

confidence: 99%

Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding

Hwangbo

et al. 2023

Micromachines

View full text Add to dashboard Cite

The aim of this study was to develop a flexible package technology using laser-assisted bonding (LAB) technology and an anisotropic solder paste (ASP) material ultimately to reduce the bonding temperature and enhance the flexibility and reliability of flexible devices. The heat transfer phenomena during the LAB process, mechanical deformation, and the flexibility of a flexible package were analyzed by experimental and numerical simulation methods. The flexible package was fabricated with a silicon chip and a polyimide (PI) substrate. When the laser beam was irradiated onto the flexible package, the temperatures of the solder increased very rapidly to 220 °C, high enough to melt the ASP solder, within 2.4 s. After the completion of irradiation, the temperature of the flexible package decreased quickly. It was found that the solder powder in ASP was completely melted and formed stable interconnections between the silicon chip and the copper pads, without thermal damage to the PI substrate. After the LAB process, the flexible package showed warpage of 80 μm, which was very small compared to the size of the flexible package. The stress of each component in the flexible package generated during the LAB process was also found to be very low. The flexible device was bent up to 7 mm without failure, and the flexibility can be improved further by reducing the thickness of the silicon chip. The bonding strength and environmental reliability tests also showed the excellent mechanical endurance of the flexible package.

show abstract

Section: Resultsmentioning

confidence: 99%