Nickel filled adhesives

Komagata, M.; Yokoyama, Kaoru; Takai, Yoshimi; Suzuki, Kenichi

doi:10.1109/iemt.1995.541078

Cited by 8 publications

(3 citation statements)

References 2 publications

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“…These include head, beard and face covers, cleanroom garments, gloves and shoe covers 20 . Moreover, the requirement of the manufacturing equipment is also strict 21 . As such, equipment surfaces exposed to the cleanroom should be cleanable and smooth.…”

Section: Introductionmentioning

confidence: 99%

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Research on metallic contamination control of PFA injection molded fittings

Liu

Xie

et al. 2023

J of Applied Polymer Sci

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In chip manufacturing, ultraclean environment is essential during wet processes such as etching, cleaning, and other stages. The fittings used in the process require corrosion resistance, which are made of perfluoroalkoxy alkanes (PFA) by injection molding. Metallic contamination is one of the major impurities for ultraclean products. This study devotes to decreasing the metallic impurities of the parts and improving the wet processes environment.First, the preliminary experiment explored impurities distribution of the injection molds. By comparing the metallic contamination of the different molds' parts, it is shown that the impurities are evenly distributed. Subsequently, the influence of process parameters, including melt temperature, injection rate, screw speed, and holding pressure, on metallic contamination was investigated through the orthogonal experiment. The results indicate that the injection rate has the greatest impact on metallic contamination, followed by melt temperature. With process optimization, the smallest metallic contamination of 1.077 μg/m 2 for pipe joints made of PFA can be achieved, which decreases by 56.3% compared with former results. This research indicates that adjusting parameters is a feasible and effective method to reduce the contamination during injection molding of ultraclean products, which provides another idea for improving the cleanliness of the environment in chip manufacturing.

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Section: Introductionmentioning

confidence: 99%

“…20 Moreover, the requirement of the manufacturing equipment is also strict. 21 As such, equipment surfaces exposed to the cleanroom should be cleanable and smooth. For fluoropolymer, injection machines usually have superior quality of corrosion-proof to extend lifespan.…”

Section: Introductionmentioning

confidence: 99%

Research on metallic contamination control of PFA injection molded fittings

Liu

Xie

et al. 2023

J of Applied Polymer Sci

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“…advantages from environmental manufacturing process and physical property points of view [3][4][5][6][7]. Some manufactures, mainly in the automotive electronics industry, have put ICAs to use as a solder replacement Silver as a conductive filler has excellent electrical conductivity.…”

Section: Introductionmentioning

confidence: 99%

Conductive Adhesives containing Ag-Sn Alloys as Conductive Filler

Toida¹,

Shirai²,

Mizmura³

et al.

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics

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Ag filled isotropic conductive adhesives (ICA) have been investigated as promising altenatives for lead containing solders in surface mount technology (SMT) applications; however, one serious concern is the ionic-mgration of the silver filled in the ICA, especially when used in high density interconnection assemblies. In his study, ionic-gration resistance and the contact resistnce of the ICA containing Ag-Sn alloy conducfive fillers were evaluated It was found that ionic-migrabon resistance depended on the Ag-Sn ratio and that Ag-Sn alloys containing 25 to 75 mol% of Sn had excellent ionic-migration resistance though their contact resistance was rather high, compared with silver. For the compatibility of the ionicn-migration resistance with lower contact resistance, and to undastand the effect of a Sn-Bi alloy powder mixture, several additives and polymer matrixes were also stxdied. New ICAs including these additives and a conventional ICA (as reference) werex evauated for SMT. Chip components with Sn plated termintions for stability in both contact resistance and adhesion strength were monitored during reliability tests. From the test results, it can be concluded that the new ICA is a potenfial material for SMT applications. Moreover, if mount loading was not sufficient and/or mount alignmient was not suitable, initial contact resistance was unstable. Therefore, we selected materials with reduction effect and we dereased the Sn ratio as low as we could The filler content rate was also increased. As a result the loading dependence was decreased.We were sucessful in keeping contact resistance more stable while maintning good ionic-migration resistance.

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