Circuit World
 1992
DOI: 10.1108/eb046187
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No‐clean and Solvent‐clean Mass Reflow Processes of 0.4 mm Pitch, 256‐Pin Fine Pitch Quad Flat Packs (QFPs)

John H. Lau
1
,
R. K. Govila
2
,
C. Larner
3
et al.
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