2015
DOI: 10.1016/j.egypro.2015.03.293
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Non-contacting Busbars for Advanced Cell Structures Using Low Temperature Copper Paste

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Cited by 12 publications
(6 citation statements)
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“…Dow Corning reported papers and patents about a curing-type copper paste and the applicable solar cell structures [47][48][49][50][51]. The curing is referred to as the hardening of polymer materials by cross-linking polymer chains that can be processed by heating at a low temperature under 300°C.…”
Section: Dow Corningmentioning
confidence: 99%
“…Dow Corning reported papers and patents about a curing-type copper paste and the applicable solar cell structures [47][48][49][50][51]. The curing is referred to as the hardening of polymer materials by cross-linking polymer chains that can be processed by heating at a low temperature under 300°C.…”
Section: Dow Corningmentioning
confidence: 99%
“…A new topic in the field of screen printed metallization is the development and application of screen printable pastes based on Cu instead of Ag [5,[27][28][29][30]. These pastes are designed to prevent oxidation of the Cu particles and Cu diffusion into the solar cells.…”
Section: Screen Printing Technologymentioning
confidence: 99%
“…Silver has good electrical conductivity and is stable [5], [6], [7], [8]. To cut costs, however, copper is being considered as a candidate that can produce highly efficient solar energy at a low cost [9], [10], [11], [12]. Nevertheless, there are limitations.…”
Section: Introductionmentioning
confidence: 99%