Novel Carboxyl-Amine Bonding Methods for Poly(dimethylsiloxane)-Based Devices

Abstract

We present a novel bonding technique for poly(dimethylsiloxane) (PDMS)-based devices employing chemical surface modifications at room temperature. PDMS surfaces were functionalized to present primary amine groups, and glass or gold substrates were functionalized to present carboxylic acid groups. Irreversible bonding was achieved by bringing the two surfaces in contact and reacting at room temperature to form peptide bonds between the substrates. Shear tests reveal the bond strengths achieved to be comparable to values obtained using conventional bonding methods. We also describe the use of carboxyl-terminated silanes on gold surfaces to bond amine-modified PDMS devices. Water contact angle measurements and X-ray photoelectron spectroscopy (XPS) confirmed the conjugation, a novel result that expands the variety of surface chemistries available for such bonding.

Ultrathin graphene oxide nanosheet membranes with various d -spacing assembled using the pressure-assisted filtration method for removing natural organic matter

“…The second peak corresponds with the bending vibration of N-H [17]. The reduction of hydroxyl, carboxyl, and alkoxy functional groups and the generation of amine confirmed that diamine likely reacts with these oxygen-containing functional groups to form C-N covalent bonds during the condensation reaction of amine with hydroxyl [25] and carboxyl [26] and the nucleophilic addition reaction of amine with epoxy [27].…”

Developing an ultra non-fouling SU-8 and PDMS hybrid microfluidic device by poly(amidoamine) engraftment

“…To introduce amino groups to the PDMS surfaces, a silane coupling method was used with minor modifications [29,30]. Briefly, PDMS surfaces were oxygen plasma treated with a plasma cleaner (SP100, Anatech Ltd, Battle Creek, MI) at 100 mTorr, 118 W for 10 s. Immediately after the plasma treatment, the activated PDMS surfaces were treated with APTMS solution for 20 s to allow PDMS surface amination by silanol condensation.…”

A simple and low-cost chip bonding solution for high pressure, high temperature and biological applications

“…Alternatively, techniques based on chemical modifications have been proposed. [4][5][6] Thermoplastics, on the other hand, are often sealed by applying pressure and temperature either above their glass transition temperature (T g ) by thermal bonding or below T g by a solvent assisted approach, 7,8 although recently the possibility of bonding cyclic olefin copolymer (COC) by applying pressure at room temperature has been reported with the right mixture of solvents. 9 These approaches require a delicate tuning to avoid the deformation of the initial structures, especially if they are small or present a high aspect ratio.…”