2008
DOI: 10.1016/j.sse.2007.10.025
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Novel concepts for improved communication between nerve cells and silicon electronic devices

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Cited by 20 publications
(16 citation statements)
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“…Gold spines for electrical measurements were prepared on silicon wafers as described by Huys et al (2008). Briefly, the electrodes were patterned by the Cu-damascene method.…”
mentioning
confidence: 99%
“…Gold spines for electrical measurements were prepared on silicon wafers as described by Huys et al (2008). Briefly, the electrodes were patterned by the Cu-damascene method.…”
mentioning
confidence: 99%
“…This would eventually lead to a stronger electrical coupling because of a higher electrical resistance in the gap between cell and chip. Preliminary data suggest strong engulfment of the electrode by the cell membrane, as could be observed by immunohistochemical actin filament staining and focused ion beam scanning electron microscopy ( Figure 1) ; Huys et al (2008); Van Meerbergen et al (2008)). Moreover, the electrodes are spaced very close to each other, which allows for single cell recording and stimulation.…”
Section: Recent Advances In Multitransistor Arraysmentioning
confidence: 64%
“…An important aspect is the interaction between the electrode and the neural tissue: a closer interaction will entail a better focalisation. To obtain such effect, 3D mushroom or pillar electrodes have been used in Micro Electrode Arrays to improve the interaction between cultivated cells and the electronic device [3].…”
Section: Introductionmentioning
confidence: 99%