Novel hybrid analysis method for via structure in microwave multilayer circuits

Tian, Yu; Tong, Ling; Li, Hailiang

doi:10.1002/jnm.810

Cited by 4 publications

(1 citation statement)

References 12 publications

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“…NNEs have been found to have better generalization properties. Thus, they are widely used to handle a variety of real-life problems [1,10,13]. There is a large volume of published studies describing the role of combination strategies in NNEs.…”

Section: Introductionmentioning

confidence: 99%

Pareto Ensembles for Evolutionary Synthesis of Neurocontrollers in a 2D Maze-Based Video Game

Tan

Teo

Chin

et al. 2013

AMM

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In this paper, we present a study of evolving artificial neural network controllers for autonomously playing maze-based video game. A system using multi-objective evolutionary algorithm is developed, which is called as Pareto Archived Evolution Strategy Neural Network (PAESNet), with the attempt to find a set of Pareto optimal solutions by simultaneously optimizing two conflicting objectives. The experiments are designed to address two research aims investigating: (1) evolving weights (including biases) of the connections between the neurons and structure of the network through multi-objective evolutionary algorithm in order to reduce its runtime operation and complexity, (2) improving the generalization ability of the networks by using neural network ensemble model. A comparative analysis between the single network model as the baseline system and the model built based on the neural ensemble are presented. The evidence from this study suggests that Pareto multi-objective paradigm and neural network ensembles can be effective for creating and controlling the behaviors of video game characters.

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Section: Introductionmentioning

confidence: 99%

Pareto Ensembles for Evolutionary Synthesis of Neurocontrollers in a 2D Maze-Based Video Game

Tan

Teo

Chin

et al. 2013

AMM

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Analysis and validation of hybrid model for signal via structures in complex conditions

Tian

Huang

Tong

et al. 2015

2015 IEEE 6th International Symposium on Microwave, Antenna, Propagation, and EMC Technologies (MAPE)

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Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate

Ren,

Wang,

Liang

et al. 2024

Journal of Electronic Packaging

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There are numbers of through ceramic vias (TCVs) in ceramic package substrates for vertical interconnection of signal, and it would be very difficult, even impossible, to create the full wave 3D model of all TCVs during signal integrity (SI) analysis of a chip package. Thus, this paper presents a p-type equivalent circuit model for a signal TCV in steady of the full wave 3D model. To improve model accuracy, the model takes into account the parasitic inductance and resistance induced by the skin effect of TCV at high frequencies, as well as the parallel plate effect between multilayer ground plane. A more accurate calculation method of via-plate capacitance is proposed based on the quasi-static method. According to the Feature Selective Verification (FSV) method, the TCV S parameters calculated by the equivalent model and using the via-plate capacitance calculation method proposed in this study are in good consistency with those from HFSS full wave 3D model in a wideband, and the solution time is reduced by 98.85%.

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Novel hybrid analysis method for via structure in microwave multilayer circuits

Cited by 4 publications

References 12 publications

Pareto Ensembles for Evolutionary Synthesis of Neurocontrollers in a 2D Maze-Based Video Game

Pareto Ensembles for Evolutionary Synthesis of Neurocontrollers in a 2D Maze-Based Video Game

Analysis and validation of hybrid model for signal via structures in complex conditions

Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate

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