2016 IEEE 66th Electronic Components and Technology Conference (ECTC) 2016
DOI: 10.1109/ectc.2016.339
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Novel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining

Toyohiro Aoki
1
,
Takashi Hisada
2
,
Eiji Nakamura
3
et al.
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Cited by 5 publications
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References 11 publications
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Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining

Aoki
1
,
Nakamura
2
,
Kohara
3
et al. 2020
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
6
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0
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Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining

Aoki
1
,
Nakamura
2
,
Kohara
3
et al. 2020
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
6
0
0
0
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Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)

Matsumoto
1
,
Watanabe
2
,
Miyazawa
3
et al. 2022
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
5
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0
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Low Cost and High Density Packaging Technologies for Ultra Small IoT Computing Systems

Mori
1
,
Aoki
2
,
Nakamura
3
et al. 2019
2019 Electron Devices Technology and Manufacturing Conference (EDTM)
0
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