2023
DOI: 10.1109/tcsii.2023.3251739
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Novel Miniaturized Self-Packaged Filters Based on Metasubstrate in SISL Platform

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Cited by 4 publications
(3 citation statements)
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“…Its wider cross-section, when compared to a microstrip or coplanar line, results in lower current densities in the circuits and lower electric-field strength in the dielectric, thereby achieving low losses. In recent years, the SISL technique has been widely proposed and used for the design of microwave circuits with enhanced performance [1][2][3][4][5][6][7][8][9].…”
Section: Introductionmentioning
confidence: 99%
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“…Its wider cross-section, when compared to a microstrip or coplanar line, results in lower current densities in the circuits and lower electric-field strength in the dielectric, thereby achieving low losses. In recent years, the SISL technique has been widely proposed and used for the design of microwave circuits with enhanced performance [1][2][3][4][5][6][7][8][9].…”
Section: Introductionmentioning
confidence: 99%
“…The measured results demonstrate less than 1 dB attenuation in the wide frequency range. In [5], the concept of meta-substrate is proposed to develop tiny self-packaged hairpin BPFs. In [6], based on SISL technology, a compact dual-band BPF with a configurable multimode resonator is built and implemented.…”
Section: Introductionmentioning
confidence: 99%
“…In the experiments and practical system application, the RF device made of a microstrip line needs to be packaged with the metal box, and the loss of the packaged microstrip line device increases. To overcome these shortcomings, many efficient SISL devices are proposed [20,21,22,23,24,25,26,27]. By using SISL, the electromagnetic shielding performance of RF devices is achieved.…”
Section: Introductionmentioning
confidence: 99%