2018 7th Electronic System-Integration Technology Conference (ESTC) 2018
DOI: 10.1109/estc.2018.8546397
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Novel Pre-applied Under-fill Material Specialized for Multiple Die Bonding Process

Masashi Okaniwa
1
,
Takenori Takiguchi
2
,
Kohei Higashiguchi
3
et al.
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Cited by 4 publications
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Voidless Underfilling and Stable Micro Solder Joint Formation for Fine Pitch Applications by Innovative Slow Cure NCF

Higashiguchi
1
,
Okaniwa
2
,
Kaimori
3
et al. 2020
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
1
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Voidless Underfilling and Stable Micro Solder Joint Formation for Fine Pitch Applications by Innovative Slow Cure NCF

Higashiguchi
1
,
Okaniwa
2
,
Kaimori
3
et al. 2020
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
1
0
0
0
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Novel Pre-Applied Underfill Material Designed for Collective Bonding Process

Okaniwa
1
,
Higashiguchi
2
,
Sekido
3
et al. 2020
IEEE Trans. Compon., Packag. Manufact. Technol.
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The Performance Effects of Bondwire Characteristics Up to mmWave Frequencies

Cekic
1
,
Ergen
2
,
Tunc
3
2021
2021 23rd European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC)
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