Novel Test Device for Non-destructive Experimental Characterization of Void Evolution in Microscale Solder Joints subjected to Thermal Aging

Prasad, Sudarshan Prasanna; Jois, Chetan; Subbarayan, Ganesh

doi:10.1109/itherm54085.2022.9899684

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Novel Test Device for Non-destructive Experimental Characterization of Void Evolution in Microscale Solder Joints subjected to Thermal Aging

Cited by 5 publications

References 7 publications

In-Line Test Structures and Non-destructive Characterization of Electromigration-Driven Phase Evolution in Microscale Solder Joints

In-Line Test Structures and Non-destructive Characterization of Electromigration-Driven Phase Evolution in Microscale Solder Joints

Fabrication and Testing of In-Line Structures for Non-Destructive Study of Solder Electromigration: Applications to SnBi Low Temperature Solder

Test device design and test procedure for non-destructive characterization of Bi phase accumulation during electromigration

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